利用扫描电镜、强度测试仪分析了高纯铜线与微Sn合金铜线不同热处理温度下组织结构及强度、伸长率的差异,研究了高纯铜线、微Sn合金铜线再结晶行为及微量合金元素Sn对高纯铜线再结晶温度的影响机理.结果表明:Sn原子与铜原子间的化学交互作用与弹性交互作用,引起高纯铜的点阵畸变,阻碍再结晶过程中铜的晶界迁移,抑制再结晶和晶粒长大,使微Sn合金铜线再结晶温度由高纯铜线的400℃提高至450℃,且高纯铜线在热处理过程中晶粒增长与热处理时间呈四次方关系;微量Sn合金减少了无空气焊球热影响区长度,热影响区长度由150 μm减少至120 μm.
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