利用诱导型等离子体辅助双靶磁控溅射法在Si(100)基板表面沉积Cu含量(原子分数)为0—10.0% 的Ti-Cu-N膜, 研究了Cu含量对薄膜结构及硬度的影响. 结果表明, 添加少量Cu可极大地提高薄膜硬度. Cu含量为2.0%的Ti-Cu-N薄膜具有超硬特性, 硬度HV达到42, 约为纯TiN薄膜硬度的2倍. 超硬质Ti-Cu-N薄膜为nc-TiN/nc-Cu纳米复合薄膜, 具有柱状晶结构. 薄膜的超硬特性源于薄膜的纳米复合结构.
Ti-Cu-N films containing approximately 0—10.0% Cu (atomic fraction) were synthesized by inductively coupled plasma assisted magnetron sputtering with two elemental targets. The effects of Cu content on film hardness and microstructure have been investigated. The addition of a small amount of Cu significantly enhanced film hardness. The Ti-Cu-N film containing 2.0%Cu has a superhard trait, with a hardness HV value of 42, which is nearly two times of that of pure TiN film. The Superhard Ti-Cu-N film was characterized as a nanocomposite structure, consisting of nanocolumns of TiN crystallites with nanocrystal Cu inside the column boundaries. The hardness enhancement was attributed to nanocomposite effect.
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