以金铂钯粉末作为导电相的电子浆料由于其优异的可焊性、耐焊性与可靠性，成为低温共烧工艺配套用关键电子浆料之一。采用2种不同特性的金铂钯合金粉末调制出相应的浆料，比较研究了2种浆料与Ferro A6生瓷料带实施共烧鹊的匹配性、电学性能、可焊性与耐焊性、附着力等性能。结果表明，高密度、亚微米级球形粉制备的浆料具有更好的综合性能。
Due to its excellent solderability, soldering resistance and high-reliability, the paste composed of trimetallic AuPtPd alloy powders is one of the key electronic pastes to apply for low temperature co-fired ceramic technology. Two different characteristics of AuPtPd alloy powders were used to prepare two electronic pastes, and matching ability of the pastes with Ferro A6 tape, and electrical properties and properties of solder resistance and adhesion strength of the pastes were studied. The experimental results show that the pastes made of submicron spherical powders with high density have better properties.
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