化学镀制备电磁屏蔽用导电复合填料的研究进展

材料导报, 2011, 25(7): 28-32.

化学镀制备电磁屏蔽用导电复合填料的研究进展

管登高 ^1, , 孙传敏 ^2, , 孙遥 ^3, , 徐冠立 ^4, , 林金辉 ^5, , 陈善华 ^6,

1.成都理工大学材料与化学化工学院,成都,610059;成都理工大学地球科学学院,成都,610059

2.成都理工大学地球科学学院,成都,610059

3.成都理工大学地球科学学院,成都,610059

4.成都理工大学地球科学学院,成都,610059

5.成都理工大学材料与化学化工学院,成都,610059

6.成都理工大学材料与化学化工学院,成都,610059

基金项目: 矿物学、岩石学、矿床学国家重点(培育)学科建设项目(SZD0407) 教育部博士点基金联合资助项目(20050616008) 四川省青年基金(09ZQ026-047)

关键词：导电填料 , 电磁屏蔽材料 , 导电性 , 化学镀 , 电磁辐射污染

Research Progress of Conductive Composite Filler Prepared by Electroless Plating for Electromagnetic Shielding

介绍了化学镀的基本原理和主要特点,重点阐述了以金属、无机非金属、聚合物等粉料为基体,采用化学镀技术制备具有不同粒度、密度、长径比、导电性、电磁屏蔽效能和抗氧化性的电磁屏蔽用金属包覆型导电复合填料的国内外研究现状和进展.分析比较了这3类电磁屏蔽用导电复合填料的优缺点,指出其目前还存在电磁阻抗不匹配、电磁综合性能不高和表面性质差异过大的主要问题,建议今后还需进一步研究复合填料组成、化学镀配方和工艺等,以研制出性价比更高的电磁屏蔽用复合填料.

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