采用由200 g/L NiSO4·6H2O、10 g/L CuSO4·5H2O、80 g/LNa3C6H5O7·2H2O、0.2 g/L C12H25SO4Na和0.5 g/L糖精钠组成的镀液,在10～60 mA/cm2、pH=2.5～5.0和25～50℃条件下电沉积制备了NiCu合金镀层.探讨了镀液pH、电流密度、温度等工艺参数对镍铜合金镀层相结构和组成的影响.结果表明,NiCu合金镀层的铜含量随电流密度或温度升高而增大.但随pH增大,镀层铜含量降低,pH小于4.0时,NiCu合金镀层中含有单质铜.
参考文献
| [1] | YING R Y .Electrodeposition of copper-nickel alloys from citrate solutions on a rotating disk electrode:I.Experimental results[J].Journal of the Electrochemical Society,1988,135(12):2957-2964. |
| [2] | CHASSAING E;VU QUANG K;WIART R .Mechanism of coppernickel alloy electrodeposition[J].Journal of Applied Electrochemistry,1987,17(06):1267-1280. |
| [3] | Solmaz R;Doner A;Kardas G .Electrochemical deposition and characterization of NiCu coatings as cathode materials for hydrogen evolution reaction[J].Electrochemistry communications,2008(12):1909-1911. |
| [4] | S. K. Ghosh;A. K. Grover;G. K. Dey;M. K. Totlani .Nanocrystalline Ni-Cu alloy plating by pulse electrolysis[J].Surface & Coatings Technology,2000(1):48-63. |
| [5] | Xinwei Cui;Weifeng Wei;Haifeng Liu;Weixing Chen .Electrochemical study of codeposition of Al particle-Nanocrystalline Ni/Cu composite coatings[J].Electrochimica Acta,2008(2):415-420. |
| [6] | Xinwei Cui;Weixing Chen .Saccharin Effects on Direct-Current Electroplating Nanocrystalline Ni-Cu Alloys[J].Journal of the Electrochemical Society,2008(9):(K)133-139. |
| [7] | The Stability Of Hydrogen Evolution Activity And Corrosion Behavior Of Nicu Coatings With Long-term Electrolysis In Alkaline Solution[J].International journal of hydrogen energy,2009(5):2089-2094. |
| [8] | 马春霞,胡会利,李宁,魏召唤.焦磷酸盐体系电镀Ni70Cu30合金工艺[J].电镀与涂饰,2009(08):17-20. |
| [9] | BASKARAN I;SANKARA NARAYANAN T S N;STEPHEN A .Pulsed electrodeposition of nanocrystalline Cu-Ni alloy films and evaluation of their characteristic properties[J].Materials Letters,2006,60(16):1990-1995. |
| [10] | Mursel Alper;Hakan Kockar;Murside Safak .Comparison of Ni-Cu alloy films electrodeposited at low and high pH levels[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2008(1/2):15-19. |
| [11] | Haciismailoglu, M.;Alper, M. .Effect of electrolyte pH and Cu concentration on microstructure of electrodeposited Ni-Cu alloy films[J].Surface & Coatings Technology,2011(6):1430-1438. |
| [12] | 王瑞永,黄中省.影响镍铜合金电镀层成分的因素[J].电镀与涂饰,2011(08):13-16. |
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