金锡二元共晶合金钎料是一种广泛应用于高可靠微电子与光电子器件封装中的连接材料，目前我国对该类高性能钎料的凝固与成形控制缺乏深入系统地研究。合金铸态组织粗大和硬脆性金属间化合物的不均匀分布是导致合金加工成形困难的根本原因，铸态组织细化将显著提高合金的加工成形性能。综述了合金的快速凝固、熔体温度处理、孕育形核处理和熔体混合处理等对金锡共晶合金凝固组织细化及组织演变规律影响等方面的研究进展。
Au-20Sn eutectic alloy solder is extensively used in high power electronics and optoelectronics packaging. The heterogeneous distribution of primary phase and coarse structure are contributed to the difficulty of the process. Therefore, refining the solidification structure becomes extremely important. The research progresses on the refinement of Au-Sn eutectic alloy solidification structure, such asthe effects of composition micro-adjustment and melt temperature treatment on the solidification microstructure, effects of incubated nucleation treatment on therefinement of solidification structure, modification of the solidification microstructure by melt mixing are summarized.
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