非平衡磁控溅射技术的关键就是设计非平衡磁控溅射靶的靶面磁场分布.改善靶面横向磁场分布的均匀性是提高靶材利用率的有效途径.通过磁场的有限元分析,得到了圆型平面非平衡磁控溅射靶结构参数对靶面磁场均匀性和强度的影响,给出了非平衡磁控溅射靶的优化设计结构,并与实验结果进行了对比分析,靶面磁场强度和分布均匀性得以明显改善.
参考文献
[1] | 张继成,吴卫东,许华,唐晓红.磁控溅射技术新进展及应用[J].材料导报,2004(04):56-59. |
[2] | Vic Comello.Target Design is Key To Successful Sputtering[J].Research and Development Magazine,2002:91. |
[3] | Kelly P J;Amell R D .Magnetron Sputtering:a Review of Recent Developments and Applications[J].Vacuum,2000,56:159. |
[4] | Peter Singer.Sputtering Faces New Challenges for Vias,UMB[M].Semiconductor International,2002:48-51. |
[5] | Shon CH.;Lee JK. .Modeling of magnetron sputtering plasmas[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2002(1/4):258-269. |
[6] | Ejima S;Shimizu Y .Magnetic Dome Configuration for Magnetron Sputtering[J].Review of Scientific Instruments,2001,72:2374. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%