为了探讨2，2’-联吡啶稳定剂对化学镀铜层微应力、晶格常数和动力学过程的影响，研究了化学镀铜的动力学过程和甲醛、Cu“的电化学反应，采用X射线衍射（XRD）和扫描电子显微镜（SEM）表征了镀层性能。结果表明：微量2，2’-联吡啶能促进反应，浓度进一步提高会阻碍反应的进行；随着2，2’-联吡啶的加入，沉积电位正移，沉积速率下降，该变化趋势与测试的结果一致；随着2，2’-联吡啶的加入，镀层的电阻率降低，而其微应力略有增加；镀层晶格常数与2，2’．联吡啶浓度无关。综合考虑溶液镀速、镀层形貌、电阻率和微应力，获得高性能化学镀铜层的最佳2，2’-联吡啶浓度为4mg／L。
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