Polycrystalline silicon thin films were prepared by RTCVD (rapid thermal chemical vapor deposition) method on several substrates such as SSP (silicon sheet from powder) ribbon,poly-Si wafer and mono-Si wafer. Intra-granular defects such as stacking faults, twins and microstructure defects were investigated on thin films by scan electron microscopy (SEM) technique.
参考文献
[1] | A Eyer;N Schillinger;I Reis;A.Rauber.[J].Journal of Crystal Growth,1990:119. |
[2] | Y F Hu;H Shen;Z Y Liu;L S Wen.[J].Acta Metallurgica Sinica(English Letters):309. |
[3] | S Reber;C.Haase;N.Schillinger;S.Bau and A.Hurrle T WCPEC3 Organising Committee.he 3rd Word Conference on Photovotaic Energy Conversion(WCPEC3)-Conference[C].Osaka,2003:4-C4-12. |
[4] | C A Dimitriadis;J Stoemenos;P.A.Coxon;S Friligkos J.Antonopoulos and N.A.Econoou.[J].Journal of Applied Physics,1993:8402. |
[5] | R Drosd;J Washburn.[J].Journal of Applied Physics,1982:397. |
[6] | Y.F.Hu;H.Shen;L.Wang;Z.Y.Liu and L.S.Wen.The 14th International Photovoltaic Science and Engineering Conference(PVSEC-14)[A].Bangkok,Thailand,2004:333. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%