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以六水合氯化镍为镍源,水合肼为还原剂,在SiC的表面,采用原位化学沉淀法制得包裹均匀的Ni/SiC复合粉体.采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)、傅立叶红外光谱仪(FT-IR)等测试表征手段研究了工艺条件对原位沉积反应的影响.研究发现不同络合反应时间形成的镍肼络合物前驱体和镀镍反应温度可以影响反应速率,从而控制Ni颗粒的沉积速率和包裹效果.对比结果表明:络合反应时间为5 min形成的镍肼络合物前驱体在50℃水浴温度下和络合反应时间为2h得到的镍肼络合物前驱体在60℃水浴温度下得到的复合粉体包裹效果最佳.

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