分别采用相同纯度(99.9%)和粒度(＜45 μm)的球形和屑状Mg粉与无定形B粉,按照MgB2化学计量比均匀混合后,在10 MPa的压力下压制成块.并在650,700,750,800和850℃温度下进行固态烧结反应制备了MgB2块材.采用浸入介质法测量MgB2块材的孔隙特征参数.结果表明,两类试样的孔隙率相近,并且都随烧结温度的升高而增大.扫描电镜分析显示,试样内的孔洞形状和尺寸与初始.Mg粉的形状和尺寸紧密相关.基于Mg-B体系的反应模型,对该体系烧结过程中孔洞形成原因进行了分析.
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