针对大直径直拉硅的微缺陷控制问题,模拟研究了初始氧浓度对于直径400 mm直拉硅单晶生长过程中原生点缺陷、空洞和氧沉淀演变规律.结果表明:晶体生长过程中氧沉淀和空洞的浓度及尺寸受晶体所经历的热历史和初始氧浓度的共同影响.当温度降低时,氧沉淀和空洞浓度降低,空洞尺寸增大,氧沉淀尺寸随初始氧浓度不同变化规律相异.在较低初始氧浓度时,随温度降低氧沉淀尺寸减小,在较高氧浓度时,氧沉淀尺寸增加.在相同热条件下,高温时,随初始氧浓度增加,空洞浓度先降低后升高,随后又继续降低；低温时,空洞浓度先不变后降低.
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