锡基焊料是电子工业上广为使用的连接材料,随着环保意识的增强,人们加强了对无铅焊料的研究.文章概述了锡基无铅电子焊料的发展概况,主要介绍了Sn-Ag、Sn-Zn、Sn-Cu和Sn-Bi四种合金系焊料的最新研究进展,指出了锡基无铅焊料的应用和发展趋势.
参考文献
[1] | W. J. Plumbridge .Tin pest issues in lead-free electronic solders[J].Journal of Materials Science. Materials in Electronics,2007(1/3):307-318. |
[2] | J.SHEN;Y.C.LIU;Y.J.HAN .Strengthening Effects of ZrO_2 Nanoparticles on the Microstructure and Microhardness of Sn-3.5Ag Lead-Free Solder[J].Journal of Electronic Materials,2006(8):1672-1679. |
[3] | 刘朋,郭福,何洪文,夏志东,史耀武.颗粒增强Sn-Ag基无铅复合钎料显微组织与性能[J].电子元件与材料,2007(06):28-30. |
[4] | 杨海平.冷却速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响[J].材料导报,2007(z1):378-379,387. |
[5] | 李宇君,杨道国,秦连城,罗海萍.Sn-Ag-Cu焊料中金属间化合物对焊接性能的影响[J].电子元件与材料,2006(05):7-8,12. |
[6] | SZU-TSUNG KAO;YUNG-CHI LIN;JENQ-GONG DUH .Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nanosized Cu_6Sn_5 Addition[J].Journal of Electronic Materials,2006(3):486-493. |
[7] | K. Mohan Kumar;V. Kripesh;Andrew A.O. Tay .Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2008(1/2):229-237. |
[8] | 薛松柏,陈燕,吕晓春,廖永平.稀土元素Ce对锡银铜无铅钎料润湿性及钎缝力学性能的影响[J].焊接学报,2005(10):1-4. |
[9] | 陈燕,薛松柏,吕晓春,廖永平.稀土元素Ce对锡银铜无铅钎料显微组织的影响[J].焊接学报,2005(12):69-72. |
[10] | 许天旱,王宇,黄敏.Ce对SnAgCu系无铅焊锡力学性能的影响[J].电子工艺技术,2006(03):135-137,140. |
[11] | 卢斌,栗慧,王娟辉,朱华伟,焦羡贺.稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响[J].中国有色金属学报,2007(04):518-524. |
[12] | H. HAO;J. TIAN;Y.W. SHI;Y.P. LEI;Z.D. XIA .Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions[J].Journal of Electronic Materials,2007(7):766-774. |
[13] | 梁丽超,桂太龙,许晶,殷景华,王玥.掺杂Sb对Sn-Ag-Cu焊料性能的影响[J].应用科技,2007(08):62-64. |
[14] | MIN HE;SYLVESTER N. EKPENUMA;VIOLA L. ACOFF .Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints[J].Journal of Electronic Materials,2008(3):300-306. |
[15] | Zhang XP;Yin LM;Yu CB .Thermal creep and fracture behaviors of the lead-free Sn-Ag-Cu-Bi solder interconnections under different stress levels[J].Journal of Materials Science. Materials in Electronics,2008(4):393-398. |
[16] | 郭康富,康慧,曲平.无铅钎料开发研究现状[J].电子元件与材料,2006(02):1-3,7. |
[17] | 魏秀琴,黄惠珍,周浪.微合金化对Sn-9Zn基无铅钎料润湿性能的影响[J].电子元件与材料,2003(11):38-39,42. |
[18] | Xiuqin Wei;Huizhen Huang;Lang Zhou .On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material[J].Materials Letters,2007(3):655-658. |
[19] | 夏志东,穆楠,史耀武.锡锌钎料的腐蚀行为[J].中国腐蚀与防护学报,2003(04):234-238. |
[20] | C.M.L.Wu;C.M.T.Law;D.Q.Yu;L.Wang .The Wettability and Microstructure of Sn-Zn-RE Alloys[J].Journal of Electronic Materials,2003(2):63-69. |
[21] | 陈国海,黎小燕,耿志挺,马莒生.新型无铅焊料合金Sn-Zn-Ga的研究[J].稀有金属材料与工程,2004(11):1222-1225. |
[22] | 袁宜耀,孙勇.无铅焊料Sn-Zn-In系列合金的研究[J].电子元件与材料,2007(08):39-41. |
[23] | 薛烽,周健,李培培,方伊莉.界面反应及界面张力对Sn-Zn-Bi焊料润湿性的影响[J].东南大学学报(自然科学版),2007(04):634-638. |
[24] | 郭福.无铅钎焊技术与应用[M].北京:北京科学技术出版社,2005:99-110. |
[25] | 王大勇,顾小龙.无铅焊料的研究现状[J].浙江冶金,2007(01):1-7. |
[26] | 顾小颜,曲文卿,赵海云,庄鸿寿.无铅电子封装Sn-Cu焊料润湿性试验研究[J].半导体技术,2006(05):337-339,349. |
[27] | F.TAI;F.GUO;Z.D.XIA;Y.P.LEI;Y.F.YAN .Processing and Creep Properties of Sn-Cu Composite Solders with Small Amounts of Nanosized Ag Reinforcement Additions[J].Journal of Electronic Materials,2005(11):1357-1362. |
[28] | Rizvi M J;Bailey C.Comparative wetting behavior of Sn-0,7Cu and Sn-0,7Cu-0,3Ni solders on Cu and Ni substrates[A].Dresden,Germany,2006:145-151. |
[29] | Toshihide Takahashi;Masahiro Tadauchi;Shuichi Komatsu .Experimental investigation of Sn/Ni/Cu interactionsat high temperatures[J].Journal of Materials Science,2006,41:281-283. |
[30] | 卢斌,王娟辉,栗慧,牛华伟,焦羡贺.微量铈对Sn-0.7Cu-0.5Ni焊料合金组织与性能的影响[J].中国稀土学报,2007(02):217-223. |
[31] | 贾红星,黄金亮,张柯柯.Ag对Sn-57Bi无铅钎料组织和性能的影响[J].河南科技大学学报(自然科学版),2004(03):10-13. |
[32] | 李元山,雷晓娟,陈振华,杨石强.新型锡铋系无铅焊料的开发[J].机械工程材料,2007(05):24-26,65. |
[33] | R. Mahmudi;A. R. Geranmayeh;S. R. Mahmoodi;A. Khalatbari .Room-temperature indentation creep of lead-free Sn-Bi solder alloys[J].Journal of Materials Science. Materials in Electronics,2007(10):1071-1078. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%