Thermal Stress in Free-standing Diamond Films with Cr Interlayer Destroyed

材料科学技术（英文）, 2010, 26(11): 991-995.

^1, , ^2, , ^3, , ^4, , ^5, , ^6, , ^7, , ^8,

1.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

2.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

3.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

4.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

5.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

6.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

7.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

8.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

基金项目: the National Natural Science Foundation of China(50471090)

Thermal Stress in Free-standing Diamond Films with Cr Interlayer Destroyed

Zheng Liu ^1, , Liangxian Chen ^2, , Chengming Li ^3, , Lifu Hei ^4, , Jianhua Song ^5, , Guangchao Chen ^6, , Weizhong Tang ^7, , Fanxiu Lv ^8,

1.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

2.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

3.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

4.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

5.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

6.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

7.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

8.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

Keywords： CVD diamond film

Thermal stress in large area free-standing diamond films was remarkable during the post-deposition cooling of direct current (DC) arc plasma jet chemical vapor deposition (CVD) process. In this research, the stress release caused by delamination of Cr interlayer was of great importance to ensure the integrity of free-standing diamond film. The effects of Cr interlayer on Mo substrate, namely composite substrate, on thermal stress were investigated. Thermo-mechanical coupling analysis of the thermal stress was applied by finite element analysis (FEA) using ANSYS code. It was found that the interlayer could be destroyed first by the large thermal stress, and then the stress could be released and the probability of diamond film crack initiation would be reduced. The stress concentration at the bent edge of diamond film was also discussed. In addition, diamond films deposited on Mo substrates with and without Cr interlayer were prepared by DC arc plasma jet CVD system and experimental measurements were used to characterize these films. It was found that composite substrate could be an efiective method of growing free-standing crack-free diamond films by DC arc plasma jet CVD system when there is no special requirement to the film strength.

参考文献

[1]	K. J. Gray;H. Windischmann .Free-standing CVD diamond wafers for thermal management by d.c. arc jet technology[J].Diamond and Related Materials,1999(2/5):903-908.
[2]	O. Durand;R. Bisaro;C. J. Brierley;P. Galtier;G. R. Kennedy;J. K. Kruger;J. Olivier .Residual stresses in chemical vapor deposition free-standing diamond films by X-ray diffraction analyses[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2000(2):217-222.
[3]	M. Hempel;M. Harting .Characterisation of CVD grown diamond and its residual stress state[J].Diamond and Related Materials,1999(8-9):1555-1559.
[4]	J.-h. Jeong;S.-Y. Lee;W.-S. Lee;Y.-J. Baik;D. Kwon .Mechanical analysis for crack-free release of chemical-vapor-deposited diamond wafers[J].Diamond and Related Materials,2002(8):1597-1605.

上一张下一张

上一张下一张

计量

下载量()
访问量()

作者相关

在本站搜索
在百度学术搜索
在万方数据库搜索
在CNKI搜索

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%