采用传统高温直接烧结和低温保温的两步烧结工艺制备铋层结构铁电陶瓷Sr0.3Ba0.7Bi3.7La0.3Ti4O15,获得结构致密、均匀、粒径介于1～3μm的陶瓷材料.结合XRD和SEM分析研究烧结工艺对陶瓷的晶相、显微结构和介电性能的影响.研究表明:采用两步烧结法使铋挥发和氧空位浓度降低,从而显著减弱了陶瓷的高温低频耗散.随着保温时间的增加,晶格畸变减少,居里温度降低了60℃左右.高温绝缘性也得到明显改善,高温电导率随保温时间的增加显著降低,保温15 h所得陶瓷样品的电导率降低了一个数量级,在280℃时为5.2×10-9S·m-1.
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