利用扫描电镜、透射电镜、聚焦离子束、强度测试仪研究了键合Cu线无卤直接镀Pd工艺及镀Pd键合Cu线性能,分析了热处理温度对直接镀Pd键合Cu线钯层界面结合强度、镀Pd键合Cu线拉断力、伸长率及钯层厚度的影响.结果表明:无卤直接镀Pd工艺可获得镀层均匀的镀Pd键合Cu线;随热处理温度增加,钯层结合强度增加,热处理温度300℃时,镀层与基体结合强度较低;热处理温度450℃时,直接镀Pd键合Cu线钯层与基体Cu之间产生了Pd3Cu5金属间化合物,钯层与铜线基体结合强度较好;热处理温度450℃时,直接镀钯铜线具有优良的力学性能适当的钯层厚度,镀Pd键合Cu线拉断力为0.096 N,伸长率为14.3％,钯层厚度为78 nm;热处理温度500℃时镀Pd键合Cu线晶粒粗大,力学性能降低,拉断力为0.073 N,伸长率为11.6％.
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