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复合磨粒抛光技术具有抛光速率高、面形精度好、表面缺陷少等优点,已成为当前的研究热点.综述了复合磨粒抛光技术中核壳型复合磨粒的制备方法、表征技术和作用机理的研究现状,指出了当前复合磨粒抛光技术存在的问题与不足,并对其发展方向进行了展望.

参考文献

[1] Armini S;Whelan C M et al.Composite polymer core silica shell abrasive:The effect of polishing time and slurry solid content on oxide CMP[J].Electrochemical and Solid State Letters,2007,10(09):H243.
[2] Novel ceria-polymer microcomposites for chemical mechanical polishing[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2008(5 Pt.2):3090.
[3] 傅毛生,李永绣,陈伟凡,危亮华,胡建东.Ce0.8Zr0.2O2固溶体磨料对ZF7光学玻璃抛光性能的改善[J].摩擦学学报,2009(02):180-185.
[4] Zhou Wenjun;Tani Yasuhiro;Kawata Kenji.Proposal of 5-Body finishing technology for long tool life[A].Suzhou,2004:275.
[5] Armini S;Whelan C M;Moinpour M et al.Copper CMP with polymer core silica size in composite:A defectivity study[J].Journal of the Electrochemical Society,2009,156(01):H18.
[6] Hiroyuki Yano;Yukiteru Matsui et al.High-performance CMP slurry with inorganic/resin abrasive for Al/low k damascene[J].Materials Research Society Symposium Proceedings,2001,617:M2.4.1.
[7] Y. Lu;Y. Tani;K. Kawata .Proposal of new polishing technology without using a polishing pad[J].CIRP Annals,2002(1):255-258.
[8] 陈杨,隆仁伟,陈志刚,丁建宁.核-壳结构PS/CeO_2复合磨料的制备及其氧化物化学机械抛光性能[J].摩擦学学报,2010(01):9-14.
[9] 肖保其,雷红.纳米SiO2/CeO2复合磨粒的制备及其抛光特性研究[J].摩擦学学报,2008(02):103-107.
[10] Feng XD;Sayle DC;Wang ZL;Paras MS;Santora B;Sutorik AC;Sayle TXT;Yang Y;Ding Y;Wang XD .Converting ceria polyhedral nanoparticles into single-crystal nanospheres[J].Science,2006(5779):1504-1508.
[11] Chemical mechanical polishing of hard disk substrate with α-alumina-g-polystyrene sulfonic acid composite abrasive[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2010(14):p.3792.
[12] Lei, H;Lu, HS;Luo, JB;Lu, XC .Preparation of alpha-alumina-g-polyacrylamide composite abrasive and chemical mechanical polishing behavior[J].Thin Solid Films,2008(10):3005-3008.
[13] Zefang Zhang;Hong Lei .Preparation of α-alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate[J].Microelectronic engineering,2008(4):714-720.
[14] A. Jindal;S. Hegde;S. V. Babu .Chemical Mechanical Polishing Using Mixed Abrasive Slurries[J].Electrochemical and solid-state letters,2002(7):G48-G50.
[15] A. Jindal;S. Hegde;S. V. Babu .Chemical Mechanical Polishing of Dielectric Films Using Mixed Abrasive Slurries[J].Journal of the Electrochemical Society,2003(5):G314-G318.
[16] Wang L Y;Zhang K L;Song Z T et al.Chemical mechanical polishing and a succulent reactive ion etching processing of sapphire wafer[J].Journal of the Electrochemical Society,2007,154(03):H166.
[17] 姚伟强,黄亦申,游红武,许雪峰.n-SiO2/BGF和PEi-BGF/SiO2两类复合磨粒及抛光液对硅的抛光性能影响[J].轻工机械,2012(03):73-76.
[18] 陈杨 .核壳结构SiO/CeO2、PS/CeO2复合微球的可控合成及其CMP性能研究[D].镇江:江苏大学,2012.
[19] 麻鹏飞,张萍,蒋春东.氧化铝复合磨粒的制备及表征[J].中国陶瓷,2012(11):26-30.
[20] Silvia Armini;Ivan U Vakarelski et al.Nanoscale indentation of polymer and composite polymer-silica core-shell submicrometer particles by atomic force microscopy[J].LANGMUIR,2007,23:2007.
[21] Tani Y;Lu Y S et al.Applications of polishing technology using polymer particles to silicon wafers and quartz crystal wafers[J].Key Engineering Materials,2007,339:263.
[22] Armini S;Whelan CM;Moinpour M;Maex K .Composite polymer core-silica shell abrasives: The effect of the shape of the silica particles on oxide CMP[J].Journal of the Electrochemical Society,2008(6):H401-H406.
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