共晶80Au-20Sn钎料在大功率电子及光电子器件封装中作为密封和芯片焊接材料特别具有吸引力,在这些应用中焊点的可靠性对于满足设备长期稳定运行至关重要.简要回顾了钎料焊点可靠性提出的背景,介绍了焊点可靠性的评价方法及当前不同工艺对80Au-20Sn钎料焊点的影响;指出今后其可靠性研究重点主要集中在复杂服役条件下焊接工艺优化、焊点可靠性测试方法、焊点寿命预测模型以及焊点本构模型等方面.
Eutectic 80Au-20Sn solder alloy is particularly attractive for high-power electronics and optoelectronics packaging as the hermetic sealing and die attachment material The reliability of solder joint is essential to meet the global demand for long operating lifetime in their applications. The research background of 80Au-20Sn solder joint is briefly reviewed first, and then the reliability assesment methods and the effects of different crafts are introduced. It is pointed that the focus of the study would be the process optimization, the reliability testing methods, the life prediction model and the constitutive model under complex service conditions.
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