研究了补强后具有幂率强化特征的广义neo-Hookean的高聚物电子封装材料,利用超弹性材料空穴分叉的理论推导出了此类封装材料在回流焊过程中空穴的生成及增长与热应力之间的解析关系.同时考虑了高聚物电子封装材料添加补强纤维后对空穴增长模型产生的影响.讨论了补强系数γ,和补强后的硬化指数n对空穴增长的影响.分析结果表明:对于补强后的电子封装材料,如果储能函数中的硬化指数为偶数形式,则空穴失稳的极限载荷将伴随着补强系数的增大而增大；反之,如果为奇数形式,则极限载荷将伴随着补强系数的增大而降低,具有这种储能形式的高聚物材料更易发生“爆米花”式的失效.
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