本文通过数值求解三维的N-S方程以及能量守恒方程,研究了树型微通道网络热沉的温度分布特点,指出了常规树型网络结构在集成微电子冷却应用中的局限性,并通过详细的分析对其进行了局部改进.改进后的树型网络极大地提高了热沉的热性能同时还降低了压降.和平行微通道相比,改进后的树型微通道网络具有更小的压降,具有更小的热阻和更好的温度均匀性.因此具有很大的应用前景.
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