研究了Cu60-Ni40wt%(简称Cu60)和CudO-Ni60wt%(简称Cu4O)两种不同组分的铜镍合金基带在不同温度下退火织构的形成过程,其中名义组分为Cu60-Ni40wt%的合金在650～1000℃退火一小时可获得良好的(001)织构.半高宽随着退火温度的升高而下降.1000~C退火后φ扫描的半高宽(FWHM)为5.5°,ω扫描的半高宽为6.1°.组分为Cu60-Ni40wt%的合金1150℃退火仍不能形成良好的织构.对于Cu40居其里温度点在室温以上,饱和磁矩大于Ni-at.%5W;而Cu60的居里温度点在20K,在77K下表现顺磁性质,其饱和磁矩仅为Ni-at.%5W基带的10%.在77K下Cu60的电阻为7.5×10-9Ω·m,比Ni-at.%5W的电阻要低的多.
The development of biaxial texture of two types of Cu-Ni alloys with nominal composition of Cu60-Ni40wt%(Cu60 for short) and Cu40-Ni60wt%(Cu40 for short),has been studied at different temperatures.The(001 ) cube texture of Cu60-Ni40wt% alloy are easily recrystallized after annealing at 650-l000? for 1 hour.The full width half maximums(FWHMs) decrease as the annealing temperature increases.The FWHM of 5.5?for phi scans and 6.1?for omega scans are observed when annealed at 1000t.The Cu40-Ni60wt% alloy does not show the high cube texture even annealed at 1150?.For the sample of Cu40,the Curie temperature of Cu40 is higher than the room temperature,and the saturation magnetization is larger than that of Ni-5at% W.In contrast,the Cu60 alloy shows a Curie temperature of 20K,being paramagnetic at 77K with 90% less saturation magnetization than that of Ni-5at% W.The resistivity of Cu60 is 7.5 x 10 -9O ?m at 77K,much lower than that of Ni-5at% W.
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