对一类具有径向摄动的广义neo-Hookean特征的高聚物电子封装材料在回流焊过程中,由于湿热的联合作用而导致的“爆米花”式的分层失效行为进行了理论研究。给出了此类各向同性不可压材料在包含单一球形孔穴的条件下孔穴的增长和湿热应力之间的解析关系;讨论了孔穴失稳的临界相当应力对初始孔穴率以及径向摄动参数的依赖关系。计算结果表明,当高聚物电子封装材料具有某种缺陷存在时,其孔穴失稳的临界相当应力将会降低,即更易发生“爆米花”式的分层失效。
A representative material cell containing a single microvoid was used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material was assumed to be a class of generalized neo-Hookean materials. Using the theory of cavity formation and unstable void growth in the incompressible hyper-elastic materials, we gained an analytical relation between the applied traction (moisture-in- duced vapor pressure and thermal stress) and void volume fraction in forementioned materials. The dependence of critical equivalence stress under void instability on initial void rates and radial perturbation parameter was also discussed. Results showed that some perturbation parameters significantly lower the critical stress levels, popcorn failure was more likely to take place.
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