不同Al含量(0.16%、0.3%和0.5%)的Cu-Al合金薄板使用Cu2O粉末包埋法内氧化,制备Cu-Al2O3弥散强化铜合金,并对其微观组织进行分析.结果表明,合金的内氧化层表层晶粒均比内部晶粒明显细小,表面晶粒为5 ~ 30μm,内部晶粒为30 ~ 100 μin;随内氧化时间增加,内氧化层深增加,但随Al含量增加而减小;内氧化层的微观组织为大量细小-γ-Al2O3相弥散分布在铜基体上;内氧化层表层γ-Al2O3粒子大小为20 ~ 50 nm,间距为50~150 nm,γ-Al2O3粒子与基体Cu的界面匹配关系是(022)Cu//(220)γ,为共格界面.
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