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电沉积镍基合金具有独特的物理、化学和机械性能,并且能够得到性能更为优异的非晶态合金,具有广阔的应用前景和乐观的发展趋势.综述了近年来国内外电沉积镍基合金及其纳米复合镀层的研究现状和发展动向,展望了今后电沉积镍基合金的发展前景,并指出了纳米复合镀中仍待进一步探讨的问题.

参考文献

[1] 张欢,郭忠诚,宋曰海,李爱莲.复合电沉积研究的新动向[J].电镀与涂饰,2003(02):29-34.
[2] 屠振密,安茂忠,张景双,杨哲龙,潘莉.电镀合金的应用及前景展望[J].电镀与精饰,2002(05):26-32.
[3] 戴洪斌 .电沉积铁-镍合金结构现象的研究[J].电镀与环保,1994,14(06):31.
[4] 王保玉.稀土在镍铁合金电沉积中的作用[J].材料保护,1998(01):12.
[5] 何湘柱.非晶态Fe-Ni合金电沉积研究[J].材料保护,1998(09):19.
[6] 张文朴.含钨镀层研究的某些进展[J].中国钨业,2000(06):32-35.
[7] 杨文,王晓东.非晶态Ni-W合金镀层电沉积影响因素和特性的研究[J].腐蚀科学与防护技术,1998(03):159.
[8] 黄令,董浚修,杨防祖,许书楷,周绍民.镍钨合金电沉积伏安特性和初期行为的研究[J].电镀与涂饰,1999(01):1-3.
[9] 黄令,董俊修,杨防祖,许书楷,周绍民.镍-钨合金电沉积层结构与显微硬度的研究[J].材料保护,1999(10):18-19.
[10] 杨防祖,曹刚敏,郑雪清,许书楷,周绍民.镍钨合金电沉积的电流效率和镀层显微硬度[J].电镀与涂饰,1999(03):1-4.
[11] 吴海玲 .镍钨合金电镀工艺[J].电镀与涂饰,1998,17(03):22.
[12] Brenner A.Electrodeposition of alloys-principles and pracrice[M].Academic Press.N Y,1963
[13] 卢燕平.电沉积非晶Ni-P合金的层状结构[J].材料保护,1994(05):5.
[14] Thomas M Harris;Quoc D Dang .The mechanism of P incorporation during the electrodeposition of Ni-P alloys[J].Journal of the Electrochemical Society,1993,140(01):81.
[15] Allen Bai;Hu Chichang .Effects of annealing temperature on the physicochemical properties of nickel-phosphorus deposits[J].Journal of Materials Chemistry and Physics,2003,79:49.
[16] Hu Chichang;Allen Bai .Composition control of electro- plated nickel-phosphorus deposits[J].Surface and Coatings Technology,2001,137:181.
[17] Peeters P;Hoorn Gvd;Daenen T et al.Properties of electro-less and electroplate d Ni-P and its application in microgalvanics[J].Electrochimica Acta,2001,47:161.
[18] Lewis D B;Marshall G W .Investigation into the structure of electrodeposited nickel-phosphorus alloy deposits[J].Surface and Coatings Technology,1996,78:150.
[19] Koga O H;Yoshio D C .Study on change in surface chemistry during the stages of electrodeposition of Ni-P alloys on Cu[J].Journal of the Electrochemical Society,1993,140:682.
[20] 涂抚洲;蒋汉瀛 等.电镀非晶态镍磷合金的研究[J].电镀与涂饰,1998,17(03):10.
[21] Matsuoka M;Imanishi S;Hayashi T .[J].Plating and Surface Finishing,1989,76:54.
[22] 邵光杰,秦秀娟,于升学,李慧,姚枚.电沉积Ni-P合金镀层在酸性介质中耐蚀性能的研究[J].表面技术,2001(05):32-35.
[23] 卢燕平.镍-磷合金镀层在盐酸溶液中的耐蚀性[J].材料保护,1991(01):17.
[24] 张云黔,史鸿运,邓洁,董俊,王健.pH值对电沉积法制备Ni-P非晶态合金镀层热稳定性的影响[J].贵州大学学报(自然科学版),2001(03):186-189.
[25] Sridharan K;Shappard K .[J].Journal of Applied Electrochemistry,1997,27:1198.
[26] Carbajal Jose L;White Ralph E .[J].Journal of the Electrochemical Society,1988,135(12):2952.
[27] 张启富,涂抚洲.非晶态镍磷合金电沉积机理的研究[J].电镀与涂饰,2001(01):1-6,11.
[28] 郭鹤桐;张天元.复合镀层[M].天津:天津大学出版社,1991:2.
[29] Cheng D H;Xu W Y;Hua L Q et al.Electrochemical preparation & mechanical properties of amorphous Nickel-SiC composites[J].Plating and Surface Finishing,1998,2:61.
[30] Wu Yucheng;Li Guanghai .Construction of wear-resistant electroless nickel phosphorus composites with silicon carbide[J].Z f Metallkunde,2000,91(09):788.
[31] Zhongcheng GUO,Xiaoyun ZHU,Dacheng ZHAI,Xianwan YANG.Electrodeposition of Ni-W Amorphous Alloy andNi-W-SiC Composite Deposits[J].材料科学技术学报(英文版),2000(03):323-326.
[32] 邓纶浩,何柳,郭忠诚,杨显万.Ni-W-B-SiC复合电镀中B的沉积机理及其对镀层硬度的影响[J].材料保护,1999(06):3-5.
[33] 李爱昌.(Ni-W)-ZrO2非晶复合镀层的制备及其性能[J].材料保护,2000(07):11.
[34] 王宙,李智,于靖华,葛毓立.电沉积Ni-W-Al2O3复合镀层工艺与性能研究[J].表面技术,2002(05):25-26.
[35] 郭忠诚,邓纶浩,杨显万,朱晓云.电沉积RE-Ni-W-P-SiC-PTFE复合材料的耐磨性研究[J].材料保护,2001(01):4-5,11.
[36] 蒋斌,徐滨士,董世运,王红美.纳米复合镀层的研究现状[J].材料保护,2002(06):1-3.
[37] 黄新民,吴玉程,郑玉春,张勇.分散方法对纳米颗粒化学复合镀层组织及性能的影响[J].电镀与精饰,1999(05):12-15.
[38] 李丽华.表面活性剂对高速Zn-SiO2复合镀层的影响[J].电镀与精饰,1996(01):8.
[39] Ricq L.;Gigandet MP.;Pagetti J.;Lallemand F. .Influence of sodium saccharin on the electrodeposition and characterization of CoFe magnetic film[J].Surface & Coatings Technology,2001(2/3):278-283.
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