通过对SiC颗粒进行表面改性处理,并向Al基体中添加Si元素合金化采用热压烧结方法制备了Al-10Si-50%（质量分数）SiC复合材料,研究了复合材料的微观组织和导热性能。结果表明,复合材料中SiC颗粒在基体中分布均匀,复合材料组织致密;SiC-Al界面清晰、平直,无过渡层和其它附加物,复合材料界面结合良好;复合材料导热性能优异,其热导率可达189W/（m·K）,能够满足电子封装材料的日常使用要求。
Al-10Si-50wt% SiC composite was fabricated by hot pressing sintering technique, through surface modification of SiC and adding Si into Al matrix. Results showed that the SiC particles distributed uniformly in the composite matrix, and overall composite was dense. The interface between SiC and Al was clear, straight and free from transient layer and other reactants. The interface connection was well and the composite showed excellent thermal conductivity as high as 189W/(m· K), which can meet the requirements of electronic packa- ging materials.
参考文献
| [1] | 褚克,贾成厂,尹法章,梅雪珍,曲选辉.高体积分数SiCP/Al复合材料电子封装盒体的制备[J].复合材料学报,2006(06):108-113. |
| [2] | 王庆平,吴玉程,洪雨,盘荣俊,闵凡飞.无压浸渗制备SiCp/Al复合材料的微观组织及弯曲性能[J].功能材料,2010(03):369-371. |
| [3] | Chawla N;Chawla K K.Metal matrix composites[M].New York:Springer US,2006:55-56. |
| [4] | 王传廷,马立群,尹明勇,刘真云,丁毅,张华,陈育贵.SiCp氧化处理对SiCp/Al复合材料润湿性和界面结合的影响[J].特种铸造及有色合金,2010(11):1062-1065. |
| [5] | 王文明,潘复生,孙旭炜,曾苏民,Lu Yun.SiCp/Al复合材料界面反应研究现状[J].重庆大学学报(自然科学版),2004(03):108-113. |
| [6] | 李丽波,安茂忠,武高辉.SiCp/Al复合材料的化学镀镍[J].功能材料,2005(07):1093-1096. |
| [7] | A. URENA;E.E. MARTINEZ;P. RODRIGO .Oxidation treatments for SiC particles used as reinforcement in aluminium matrix composites[J].Composites science and technology,2004(12):1843-1854. |
| [8] | 程南璞,曾苏民,于文斌,陈志谦.12%SiCp/Al复合材料制备工艺及力学性能研究[J].粉末冶金技术,2006(06):417-420,426. |
| [9] | Lee J.C.;Ahn J.P. .Modification of the Interface in SiC/Al Composites[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2000(9):2361-2368. |
| [10] | Zhong W M;Lesperance G;Surey M .[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1995,26(10):2637. |
| [11] | Jae-chul Lee;Ji-young Byun;Chang-seod Oh .Effect of various processing methods on the interfacial reactions in SiC_p/2024 Al composites[J].Acta materialia,1997(12):5303-5315. |
| [12] | Kawal C .Effect of interracial reaction on the thermal conductivity of A1-SiC composites with SiC dispersions[J].Journal of the American Society,2001,84(04):896-898. |
| [13] | 王常春 .电子封装用SiCp/Cu复合材料的微观组织与性能研究[D].山东大学,2007. |
| [14] | Jung-Moo Lee;Sang-Kwan Lee;Sung-Jin Hong;Yong-Nam Kwon .Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method[J].Materials & design,2012(May):313-316. |
| [15] | Molina J M;Prieto R;Narciso J et al.The effect of po- rosity on the thermal conductivity of Al-12wt% Si/SiC composites[J].Scripta Materialia,2009,60:582-585. |
| [16] | Chu K;Jia C;Tian W et al.Thermal conductivity of spark plasma sintering consolidated SiCp/A1 composites containing pores:numerical study and experimental vali- dation[J].Composites,2010,41:161-167. |
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