Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interracial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400℃. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360℃. In static liquid-state interracial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-SCu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.
参考文献
[1] | J.W. Jang;P.G. Kim;K.N. Tu .High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu-Cr thin films[J].Journal of Materials Research,1999(10):3895-3900. |
[2] | A.R.GERANMAYEH;R.MAHMUDI .Room-Temperature Indentation Creep of Lead-Free Sn-5%Sb Solder Alloy[J].Journal of Electronic Materials,2005(7):1002-1009. |
[3] | M.D. MATHEW;H. YANG;S. MOVVA .Creep Deformation Characteristics of Tin and Tin-Based Electronic Solder Alloys[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2005(1):99-105. |
[4] | A.A. El-Daly;Y. Swilem;A.E. Hammad .Creep properties of Sn-Sb based lead-free solder alloys[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2009(1/2):98-104. |
[5] | VIANCO P.T.;REJENT J.A. .Properties of Ternary Sn-Ag-Bi Solder Alloys: Part II-Wettability and Mechanical Properties Analyses[J].Journal of Electronic Materials,1999(10):1138-1143. |
[6] | HYUCK MO LEE;SEUNG WOOK YOON;BYEONG-JOO LEE .Thermodynamic Prediction of Interface Phases at Cu/Solder Joints[J].Journal of Electronic Materials,1998(11):1161-1166. |
[7] | K. H. PRAKASH;T. SRITHARAN .INTERFACE REACTION BETWEEN COPPER AND MOLTEN TIN-LEAD SOLDERS[J].Acta materialia,2001(13):2481-2489. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%