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Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interracial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400℃. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360℃. In static liquid-state interracial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-SCu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.

参考文献

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