材料期刊网

Eutectic alloy Sn-9Zn is an attractive candidate for lead-free solders. However, its wettability to copper is poor thus,its development was limited. Effects of less than 1% (mass fraction) additions of mischmetal consisting mainly of La and Ce, heavy rare earth Y, pure P, Al, Mg and Ti elements on the wetting/adhesion behavior of Sn-9Zn alloy to copper, as well as the associated oxidation and solidification morphology of this alloy were examined. The results show that harmful effect on the wettability can be found when adding Al and Ti elements, while the wettability can be improved slightly by adding Mg and Y elements. The adhesion of the alloy to copper can be decreased by Mg element. The RE and P are found to significantly improve the wettability. In addition, oxidation of the alloy can be increased by adding RE, while little effect on the oxidation behavior can be found by adding P element. As-solidified Sn-9Zn alloy has a rough surface with protrusions and cavities shaped by coarse needle-like crystallites, while the Sn-37Pb sample has a rather smooth surface, which indicates the different solidification behavior of Sn-9Zn alloy and the Sn-37Pb one. The additions of the different elements investigated in this study do not alter Sn-9Zn's as-solidified morphology.