利用两步阳极氧化方法在玻璃基板上成功制造孔洞排列有序的多孔氧化铝基底,实验结果表明,孔洞大小范围在10～50nm,孔洞大小可通过氧化电压和氧化温度进行调节,随氧化电压和温度降低而减小.多孔氧化铝底层对其上溅射生长的TbFeCo磁性能有重要影响,多孔氧化铝基底对TbFeCo的畴壁运动有较强的钉扎作用,增大其矫顽力,矫顽力随孔洞的直径增大而减小,从15nm时的4.5×105A/m下降到40nm时的2.8×105A/m,并逐步趋近无AAO膜板时TbFeCo的矫顽力.同时多孔氧化铝基底的引入,使TbFeCo薄膜的矫顽力机制从以磁晶各向异性为主改变为以形状各向异性为主.
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