对电子封装工业生产中无铅合金焊料的回流曲线工艺进行了研究,引入了3种不同回流因子,即加热因子,预热因子、冷却因子.针对不同回流因子,分析了其剪切试验中剪切断面的形貌和成分,研究表明,大部分条件下断裂一般会发生在焊料内部区域,然而在焊料界面结合较弱时,断裂通常会发生在金属问化合物和基板界面处.总结提出了3种回流因子的合理取值范围,得到回流炉中Sn3.5Ag0.5Cu的最佳回流曲线,为工业上探索新的回流曲线提供了实验方法.
参考文献
| [1] | 吴懿平;谯锴.加热因子-回流焊曲线的量化参数[J].现代表面贴装资讯,2002(01):63. |
| [2] | 吴丰顺,陆俊,安兵,王磊,张晓东,吴懿平.焊膏回流性能动态测试法及其应用[J].电子元件与材料,2004(06):38-41. |
| [3] | 吴懿平.再论回流曲线的量化参数[J].环球SMT与封装,2005(05):4. |
| [4] | 高金刚,吴懿平,丁汉.基于加热因子的回流曲线的优化与控制[J].电子工业专用设备,2006(08):23-29. |
| [5] | Qi Yan;Lam Rex;Ghorbani et al.Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints[J].Microelectronics Reliability,2006,46(02):574. |
| [6] | 王考,陈循,褚卫华.温度循环应力剖面对QFP焊点热疲劳寿命的影响[J].计算力学学报,2005(02):170-175. |
| [7] | Kim P G;Jang J W;Lee T Y et al.Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils[J].Journal of Applied Physics,1999,86(11):6746. |
| [8] | D.R.Frear .The Mechanical Behavior of Interconnect Materials for Electronic Packaging[J].JOM,1996(5):49-53. |
| [9] | Ahmed Sharif;Y.C. Chan;Rashed Adrian Islam .Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2004(issue 2):120-125. |
| [10] | Josell, D;Bonevich, JE;Carter, WC .Stability of multilayer structures: capillary effects[J].Nanostructured Materials,1999(1/4):387-390. |
| [11] | Van Heerden D;Gavens A J;Subramanian P R et al.The stability of Nb/Nb5 Si3 microlaminates at high temperatures[J].Metallurgical and Materials Transactions,2001,32A:2363. |
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