基于显热容法,建立复合相变材料应用于电子散热的传热模型及相应的数值计算方法,利用Icepak软件进行数值计算,分析了温度场及流场分布。模拟结果与实验测量值相接近,其最大相对误差为8.8%,说明所采用的数值模型及相关简化处理正确。借助热分析方法可以真实地模拟系统的热状况,从而为电子设备的热设计和热管理提供依据。
According to the apparent heat capacity method,the heat transfer model and relevant numerical method in electronic cooling with composite phase change material（PCM） were built.The Icepak software was used to carry out the thermal analysis in this model and its temperature field and flow field were analyzed.The results of numerical simulation are close to the experimental values and the maximum relative error between them is 8.8%,which indicate that the numerical model and relevant simplified methods are accurate.It can simulate the thermal status in the electronic devices factually in virtue of the thermal analysis means and accordingly provide a basis for the thermal design and thermal management of electronic devices.
参考文献
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