为了满足电子封装材料越来越高的性能要求,采用放电等离子烧结(SPS)工艺制备了SiC_P/Al复合材料.研究了烧结温度和保温时间等工艺条件对SiC_P/Al复合材料组织形貌和性能的影响.结果表明:采用SPS烧结,温度为700℃、保温时间为5 min时,所制备的70 vol%SiC_P/Al复合材料热导率达到195.5 W(m·K)~(-1),与传统15%W-Cu合金相当,是Kovar合金的10倍,但密度小,仅为3.0 g·cm~(-3);其热膨胀系数为6.8×10~(-6)K~(-1),与基板材料热膨胀系数接近;抗弯强度为410 MPa,抗拉强度为190 MPa,达到了电子封装材料对热学性能和力学性能的要求.
The high thermal conductivity SiC_P/Al electronic packaging materials were successfully prepared by the spark plasma sintering (SPS) process. The effects of sintering temperature and holding time on the microstructure of SiC_P/Al composites were researched. And thermo- physical characteristics of final composites were also evaluated. The results show that the thermal conductivity of 70 vol% SiC_P/Al composites fabricated by SPS is and the bend strength is 410 MPa, tensile strength is 190 MPa, satisfying the electronic packaging materials needs in thermal and mechanics properties.
参考文献
| [1] | 张蜀平,郑宏宇.电子封装技术的新进展[J].电子与封装,2004,4(1):3-7.Zhang Shuping,Zheng Hongyu.New progress of electronic packaging technology[J].Electronics & Packaging,2004,4(1):3-7. |
| [2] | 褚克,贾成厂,尹法章,梅雪珍,曲选辉.高体积分数SiC_P/Al复合材料电子封装盒体的制备[J].复合材料学报,2006,23(6):108-113.Chu Ke,Jia Chengchang,Yin Fazhang,Mei Xuezhen,Qu Xuanhui.Fabrication on electronic package box of SiC_P/Al composites with high volume fraction of SiC_P[J],Acta Materiae Compositae Sinica,2006,23(6):108-113. |
| [3] | 喇培清,许广济,丁雨田.高体积分数粒子型铝基复合材料热膨胀性能的研究[J].复合材料学报,1998,15(2):7-12.La Peiqing,Xu Guangji,Ding Yutian.Study of thermal expansion property for high volume fraction particulate reinforced aluminium matrix composites[J].Acta Materiae Compositae Sinica,1998,15(2):7-12. |
| [4] | 褚克,贾成厂,梁雪冰,曲选辉.注射成形制备SiC_P/Al复合材料电子封装盒体的预成形坯[J].北京科技大学学报,2007,29(5):470-474.Chu Ke,Jia Chengchang,Liang Xuebing,Qu Xuanhui.Fabrication of the electronic package box preform of SiC_P/Al composites by powder injection molding[J].Journal of University of Science and Technology Beijing,2007,29 (5):470-474. |
| [5] | 楮克,贾成厂,梁雪冰,曲选辉.注射成形与压力熔渗方法制备高体积分数SiC_P/Al封装盒体及其导热性能分析[J].粉末冶金技术,2007,25(5):348-351.Chu Ke,Jia Chengchang,Liang Xuebing,Qu Xuanhui.Fabrication of SiCp/Al composites with high volume fraction SiC_P by PIM and pressure infiltration[J].Powder Metallurgy Technology,2007,25(5):348-351. |
| [6] | Gu X F,Zhang L M,Yang M J,Zhang D M.Fabrication by SPS and thermophysical properties of high volume fraction SiC_P/Al matrix composites[J].Key Engineering Materials,2006,313:171-174. |
| [7] | 冯海波,周玉,贾德昌.放电等离子烧结技术的原理及应用[J].材料科学与工艺,2003,11(3):327-331.Feng Haibo,Zhou Yu,Jia Dechang.Principle and application of spark plasma sintering technology[J].Material Science and Technology,2003,11(3):327-331. |
| [8] | 汪胜祥,郑勇,刘文俊.SPS烧结技术及其在陶瓷材料制备中的应用[J].硬质合金,2003,20(4):232-236.Wang Shengxiang,Zheng Yong,Liu Wenjun.SPS technology and its application in preparation of ceramics[J].Cemented Carbide,2003,20(4):232-236. |
| [9] | 梁雪冰,褚克,贾成厂.放电等离子烧结制备Diamond/Al复合材料[J].复合材料学报,2008,25(6):192-197.Liang Xuebing,Chu Ke,Jia Chengchang.Diamond/Al composites fabricated by spark plasma sintering[J].Acta Materiae Compositae Sinica,2008,25(6):192-197. |
| [10] | 王文明,潘复生,孙旭炜,曾肃明,刘云.SiC_P/Al复合材料界面反应研究现状[J].重庆大学学报,2004,27(3):8-111.Wang Wenming,Pan Fusheng,Sun Xuwei,Zeng Suming,Liu Yun.Advance in research on interfacial reaction in SiC_P/Al composites[J].Journal of Cbongqing University,2004,27(3):8-111. |
| [11] | 陈建,潘复生,刘天模.SiC_P/Al界面结合机制的研究现状[J].轻金属,2000(9):52-55.Chen Jian,Pan Fushen,Liu Tianmo.Present status of study on the intedacial bonding mechanism in the SiC_P/Al composites[J].Light Metals,2000(9):52-55. |
| [12] | 陈建,潘复生.刘天模.Al/SiC界面结合机制的研究现状(续)[J].轻金属,2000(11):56-59.Chen Jian,Pan Fushen,Liu Tianmo.Present status of study on the interracial bonding mechanism in the Al/SiC composites Ⅱ[J].Light Metals,2000(11):56-59. |
| [13] | Yin Fazhang,Jia Chengehang,Mei Xuezhen,et al.Manufacture of SiC_P/Al composites by pressure infiltration process[J].Materials Science Forum,2005,475-479:913-916. |
| [14] | Liu Jun,Zheng Zhixiang,Wang Jianmin,et al.Pressureless infiltration of liquid aluminum alloy into SiC preforms to form near-net-shape SiC/Al composites[J].Journal of Alloys and Compounds,2008,465(1/2):239-243. |
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