采用国产3Y-TZP亚微米粉体,通过双向模压结合等静压成形有效克服了条形试样的烧结弯曲,探讨了24 h排胶工艺对预烧试样力学性能的影响,通过对预烧试样热膨胀曲线的测定、不同烧结温度试样力学性能和密度的比较及XRD定量分析确定了适宜的烧结工艺.结果表明,排胶工艺对预烧试样的抗弯强度和断裂韧性并无显著影响,对于牙科支架用陶瓷,将预烧试样升至1550℃保温0.5 h,即可获得足够的抗弯强度,提高其断裂韧性.
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