本文用位错蠕变模型, 描述了在电流作用下, 无铅焊料Sn-Ag-Cu(SAC)中第二相粒子Ag3Sn的粗化过程及其对蠕变速率的影响. 模型中焊料组织被简化为: β-Sn母相基体和在基体上弥散分布的Ag$_{3}$Sn第二相粒子. 基于Lifshitz--Wagner理论, 得到了描述第二相粒子尺寸演化的关系式, 式中包括稳态应变和电流作用引起的两部分粗化.
Coarsening of the microstructure in Sn–Ag–Cu (SAC) solder joints under current stressing was bserved experimentally and modeled by a disocation–creep model which incorporates te carsening f second pase particles in lead–free solder aoys. Both the effects of electric current and strain–enhanced coarsening were conidered in thimodel. The straining effect took into account of both the inelastic–strain hstory and hydrostatic constraint. The model describes well the evolution of thutectic microstructure and the predictions of the model agree reasonably well with experimentally observed trends.
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