欢迎登录材料期刊网

材料期刊网

高级检索

由于硫脲的分子结构特点,且与贵金属有着特殊亲合力,其在电镀工业中有着广泛的应用.总结了硫脲在电镀和化学镀工艺中的应用.硫脲作为配位剂可用于化学镀,退除不良镀层和电镀贵金属;同时作为稳定剂可用于化学镀镍、铜、镍磷合金和浸锡;而且还可作为特殊添加剂应用于电镀锌、铜、镍、镉、锌锰和铜金合金等;此外还论述了硫脲使用的局限性及目前存在的问题的解决方法.

参考文献

[1] 程德平,夏式均.硫脲浸出银及其机理的探讨[J].杭州大学学报(自然科学版),1996(01):39.
[2] 李奇,石梅,麦松威.尿素/硫脲/硒脲晶体及其管状包合物的结构化学[J].自然科学进展,2002(04):337-343.
[3] 吴水清 .硫脲在电镀溶液中的化学效应[J].电镀与涂饰,1991,10(02):45-51.
[4] 《浸矿技术》编委会.浸矿技术[M].北京:原子能出版社,1994
[5] 朱声逾,戴桂贞.硫脲反萃金的研究[J].贵金属,1989(04):51-53.
[6] 傅建顺;周展云;杨惠明 .用硫脲从季铵盐萃取液中反萃金、银、铜的探索[J].化学工业与工程,1990,7(03):17-20.
[7] 邓春春;高孝恢 .金硫脲络合物成键及结构性能的研究[J].化学研究与应用,1989,1(01):48-52.
[8] 加藤胜;岩井良太 .无电解镀金液[P].CN 1435510,2003-01-30.
[9] 成江,胡柏星,沈健.化学镀锡铅合金[J].电镀与环保,2001(03):18-21.
[10] 郑永芳 .一种粉末镀银镀料及其配制工艺[P].CN 1088999,1992-12-29.
[11] 吴水清.印制电路镍层退除方法[J].表面技术,1990(06):22-28.
[12] 吴水清.不合格金属氧化物的退除方法[J].表面技术,1990(05):32-37.
[13] 蔡积庆.化学镀Sn-Zn合金[J].电镀与环保,2001(02):27-29.
[14] 王丽丽.化学镀锡-银合金[J].电镀与精饰,2002(06):30-33.
[15] 王丽丽.化学镀锡合金[J].电镀与精饰,2001(01):41-44.
[16] Laeeoni G I;Maeagno V A .Electrochemical study of thiourea in relation to the silver electrodeposition process[J].Electroehimiea Acta,1994,39(17):2605-2601.
[17] Upadhyay DN.;Yegnaraman V. .Effect of thiourea and substituted thioureas on copper underpotential deposition on gold[J].Materials Chemistry and Physics,2000(3):247-253.
[18] Minjer C H;Brenner A .Eleetroless deposition of nickle[P].US 2929742,1973.
[19] Lin KL.;Hwang JW. .Effect of thiourea and lead acetate on the deposition of electroless nickel[J].Materials Chemistry and Physics,2002(2):204-211.
[20] Cheong WJ;Luan B L;Shoesmith D W .The affects of stabilizers on the bath stability of eleetroless Ni deposition and the deposit[J].Applied Surface Science,2004,229(1-4):282-300.
[21] Xu H;Brito J;Sadik O A .Mechanism of stabilizer aceeleration in electmless nickel at wirebond substrates[J].Journal of the Electrochemical Society,2003,150(01):C816.
[22] Sallo J S;Kivel J;Alberts F C .Badiochemical studies of thiourea in the electmless deposition process[J].Journal of the Electrochemical Society,1963,110(08):890-894.
[23] Kivel J;Sallo J S .The Effect of Thiourea on Alkaline Electroless Deposition[J].Journal of the Electrochemical Society,1965,112(12):1201-1203.
[24] Fsrid H;Hamid Z A;Abdel A .Controlling factors affecting the stabilityand rate of electroless copper phting[J].Materials Letters,2004,58(1,2):104-109.
[25] Baskaran I;Narayanan TSNS;Stephen A .Effect of accelerators and stabilizers on the formation and characteristics of electroless Ni-P deposits[J].Materials Chemistry and Physics,2006(1):117-126.
[26] 韩克平.硫脲稳定化学镀镍的机理[J].电镀与精饰,1996(03):11.
[27] Han K P;Jing L F .Stabilization Effect of Electroless Nickel Plating by Thiortes[J].Metal Finishing,1997,95(02):73-75.
[28] Han K P;Fang J L .Acceleration effect of electroless nickel deposition by thiourea[J].International Journal of Chemical Kinetics,1996,28(04):259-264.
[29] 雷志刚,郑传明,韩荣生,朱广东,贺国旭.四种稳定剂对化学镀镍液及镀层耐蚀性的影响[J].腐蚀与防护,2007(03):135-137.
[30] 郭炳焜.酸性光亮镀锌阴极极化曲线研究[J].电镀与精饰,1985(03):6.
[31] 李鸿年.电镀工艺手册[M].上海:上海科学技术出版社,1989
[32] 王昕,张春丽.钢铁件酸性镀铜前的预镀工艺研究[J].当代化工,2003(01):15-17.
[33] Lukomska A;Smolinski S;Sobkowski J .Adsorption of thiourea on monoerystalline copper electrodes[J].Electrochimica Acta,2001,46(20-21):3111-3117.
[34] Farndon EE.;Campbell SA.;Walsh FC. .EFFECT OF THIOUREA, BENZOTRIAZOLE AND 4,5-DITHIAOCTANE-1,8-DISULPHONIC ACID ON THE KINETICS OF COPPER DEPOSITION FROM DILUTE ACID SULPHATE SOLUTIONS[J].Journal of Applied Electrochemistry,1995(6):574-583.
[35] Fabricius C.;Sundholm G.;Kontturi K. .INFLUENCE OF THIOUREA AND THIOUREA AGEING ON THE ELECTRODEPOSITION OF COPPER FROM ACID SULFATE SOLUTIONS STUDIED BY THE RING-DISC TECHNIQUE[J].Journal of Applied Electrochemistry,1996(11):1179-1183.
[36] Suarez D F;Olson F A .Nodulation of electrodeposited copper in the presence of thiourea[J].Journal of Applied Electrochemistry,1992,22(11):1002-1010.
[37] Maher Alodan;William Smyrl .Effect of thiourea on copper dissolution and deposition[J].Electrochimica Acta,1998(2/3):299-309.
[38] M. A. Alodan;W. H. Smyrl .Confocal laser scanning microscopy, electrochemistry, and quartz crystal microbalance studies of leveling effects of thiourea on copper deposition[J].Journal of the Electrochemical Society,1998(3):957-963.
[39] Krzewska S;Pajdowski L;Podsiadly H et al.Electrechemical determination of thiourea and glue in the industrial copper electrolyte[J].Metallurgical and Materials Transactions,1984,15(03):451-459.
[40] Nisit Tantavichet;Mark D. Pritzker .Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions[J].Electrochimica Acta,2005(9):1849-1861.
[41] Moo Seong Kang;Soo-Kil Kim;Jae Jeong Kim .A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea[J].Japanese journal of applied physics,2005(11):8107-8109.
[42] Nikolic N D;Novakovic G;Rakocedc Z et al.Comparative reflection and smlemraI analyses of copper and zinc coatings electrodeposited from acid sulfate solutions with and without additives[J].Surface and Coatings Technology,2002,161(2-3):188-194.
[43] Kao Y L;Tu G C;Huang C A.The annealing behavior of copper deposit electroplatod in sulfuric acid bath with various concentrations of thiourea[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2004(382):104-111.
[44] Muresan L;Varvara S;Mauffin G et al.Effect of some organic additives upon copper electrowinning from sulphate electrolytes[J].Hydrometalhrgy,2002,54(2-3):161-169.
[45] Ke B;Hoekstra J J;Sison B c et al.Role of Thiourea in the Electrodeposition of Copper[J].Journal of the Electrochemical Society,1959,106(05):382-388.
[46] 廖义佳.D·K微氰镀锌[J].材料保护,1989(09):37.
[47] 张绍恭;孙旭辉.化学镀与合金电镀[M].上海:上海市科学技术编译馆,1963
[48] 许姣姣,司云森.硫脲对电沉积纳米晶镍的影响[J].云南化工,2007(02):17-19.
[49] 李广超,路长青,杨文忠,俞斌.硫脲及其衍生物的缓蚀行为研究进展[J].腐蚀科学与防护技术,2001(03):169-172,封3.
[50] 曹楚南.缓蚀剂研究中的电化学测量技术[J].材料保护,1990(02):40-43.
[51] 吴水清.不合格金属氧化物的退除法[J].表面技术,1990(05):32-37.
[52] 胡光辉,吴辉煌,杨防祖,王森林.硫脲对镍电沉积的作用[J].电化学,2004(01):94-97.
[53] 肖景中.硫脲溶金的热力学分析及结构探讨[J].昆明工学院学报,1986(02):73-81.
[54] 贾洪斌;匡华.有机化学[M].北京:科学出版社,2006:9.
[55] 贾学顺;王玉炉;蔡昆.硫脲衍生物的制备及其应用[J].河南师范大学学报(自然科学版),1990(01):43-48.
[56] 杨小青,董文魁,冯建华.酰基硫脲衍生物及其配合物研究进展[J].山东化工,2006(03):19-22.
[57] 李广超,路长青,杨文忠,俞斌.硫脲及其衍生物的缓蚀行为研究进展[J].腐蚀科学与防护技术,2001(03):169-172,封3.
[58] 吴达旭,沈旭.硫脲衍生物及其Cu+配合物的NMR研究[J].分析测试学报,1999(02):53-55.
[59] 董云会.硫脲及其衍生物对铜阴极电沉积影响的电化学研究[J].电化学,1999(03):342.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%