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利用电阻式真空蒸镀系统制备出了颗粒锡膜,并通过场发射电子显微镜(FSEM)对其生长进行了表征.研究发现,锡膜的表面形貌与氧压及基片温度强烈相关.随着氧压升高,锡膜颗粒粒径减小,形状趋于规则;随着基片温度升高,锡膜颗粒趋于规则,粒径先增后减.就颗粒锡膜的连通性及气敏性进行了初步研究,成膜后高温退火有助于提高颗粒锡膜的连通性,200℃工作环境下膜对氧气具有相当高的气敏性.

参考文献

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