<正> 一、前言 随着精细陶瓷材料的研究和应用所取得的巨大进展,金属与陶瓷的连接已成为急待解决的关键问题。由于普通金属钎料对陶瓷表面不浸润,因而许多工作集中在添加少量的钛或锆以改善钎料在陶瓷表面的可润湿性。其中特别是添加5at％Ti的Ag-Cu共晶钎料,因其综合性能优越,而最有发展前途。鉴于结构陶瓷主要在高温条件下使用,所以金属/陶瓷接头
The oxidation behavior of Ag-Cu eutectic based active brazing alloys is studied by means of TGA, DTA, sessile drop method and X-ray diffraction technique. The results show that although the oxidation resistance of Ag-Cu eutectic-5at%Ti alloy at 873K is very poor, it can be improved by the addition of Al(5at%) without loss of its excellent wettability (contact angle 15° on sialon ceramic at 1150K for 5min). The oxidation kinetics behavior of the alloy with Al addition does not follow the parabolic law. In fact, the growth of the oxide film on the alloy becomes extremely slow after oxidation for 20 hours at 873K. The beneficial effect of aluminum can be attributed to the formation of an adhesive, protecive oxide film of CuAl_2O_4 on the alloy surface. As compared with the above results, the addition of Cr, Ni or RE is not effective in the improvement of oxidation resistance of the Ag-Cu-Ti brazing alloy.
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