采用快速凝固法制备了Ti53.5Ni22.8Cu23.7合金薄带,对快速凝固合金条带在不同温度下退火热处理态的微观结构进行了X射线衍射和TEM分析.结果表明, 在450℃退火处理时,合金组织为B19、B2和条状析出物共存,条状析出物与基体呈共格关系,宽约为10~15nm;500℃退火以后形成纳米多晶B19和单晶B19的混合组织;Ti2(Ni+Cu)析出物在高于550℃以上温度退火时形成,其晶粒尺寸随温度升高长大,板条宽由30~50nm变化到200~300nm;在650℃退火态下,Ti2(Ni+Cu)晶粒进一步长大并影响马氏体的形貌,局部区域高密度晶界相互叠加形成莫尔条纹.
参考文献
[1] | 徐祖耀;江伯鸿;杨大智.形状记忆材料[M].上海:上海交通大学出版社,2000:51. |
[2] | Nam T H;Kim J H;Kim T Y et al.[J].Journal of Materials Science and Letters,2002,21:1851-1853. |
[3] | Santamarta R;Schryvers D .[J].Intermetallics,2004,12:341-348. |
[4] | Santamarta R;Schryvers D .[J].Materials Transactions Jim,2003,44:1760-1767. |
[5] | Sato C;Ledda A;Potapov P et al.[J].Intermetallics,2001,9:395-401. |
[6] | Nam T H;Saburi T;Nakata Y et al.[J].Materials Transactions Jim,1990,31:1050-1056. |
[7] | Cheng G P;Xie Z L;Liu Y .[J].Journal of Alloys and Compounds,2006,415:182-187. |
[8] | Xie Z L;Van Humbeeck J;Liu Y et al.[J].Scripta Materialia,1997,37:363-371. |
[9] | Otsuka K;Ren X .[J].Progress in Materials Science,2005,50:511-678. |
[10] | Fukuda T.;Kitayama M. .Martensitic Transformation Behavior of a Shape Memory Ti-40.5Ni-l0Cu Alloy Affected by the C11_b-type Precipitates[J].Materials transactions,1996(10):1540-1546. |
[11] | Kikuchi T;Ogawa K;Kajiwara S et al.[J].Phill Mag A,1998,78:467-489. |
[12] | Vermaut P.;Litynska L.;Portier R.;Ochin P.;Dutkiewicz J. .The microstructure of melt spun Ti-Ni-Cu-Zr shape memory alloys[J].Materials Chemistry and Physics,2003(2/3):380-382. |
[13] | Rentenberger C;Waitz T;Karnthaler H P .[J].Scripta Materialia,2004,51:789-794. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%