Sn-Zn无铅钎料因其低廉的成本、适合的熔点和良好的机械性能而受到众多研究者的高度关注.综述了Sn-Zn基无铅钎料的研究现状与存在的关键技术问题,分析了添加Bi、Ag、Cu、Al及稀土Re对Sn-Zn钎料熔点、润湿性、力学性能、抗氧化腐蚀及接头组织的影响,指出必须同时进行钎料的合金化、新型钎荆及改进钎焊工艺的研究,才能完成Sn-Zn基无铅钎科的工业实用化.
Sn-Zn Pb-free solder has caught the attention from many researchers because of the low cost, sui-tablemehing point and good mechanical performance. The recent status of Sn-Zn Pb-free solders and existing key tech-nical problems are summarized. The effects of adding elements such as Bi, Ag, Cu, Al and Re on the melting point, wettability, mechanics performance, oxidation and corrosion resistance, and microstructure in joint are analyzed. It is pointed out that studying of solder alloying, new flux and soldering technics at the same time, to realize industrial ap-plication of Sn-Zn Pb-free solders.
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