纳米粒子由于尺寸效应,可导致其熔点降低.对于无铅焊料而言,熔点的降低将减少因高熔点无铅焊料的使用而带来的封装过程的缺陷.通过电弧法制备了Sn3.5 Ag合金的纳米粒子.X射线衍射(XRD)及能谱(EDS)测试结果证明,母合金及所制备的纳米粉末中,都形成了金属间化合物Ag3Sn相,说明该制备过程的合金化完全.SEM二次电子像和TEM明场像结果说明所制备的纳米粒子呈球状,且尺寸均在50 nm以下,部分甚至小于10 nm.差示扫描量热仪(DSC)的测试结果证实所获SnAg纳米粒子的平衡熔点约为198.6℃,较之块状样品的平衡熔点(221℃)降低约22℃.说明采用纳米技术可以获得低熔点的Sn基纳米无铅焊料,是很有潜力的获取低熔点无铅焊料的技术途径.
参考文献
| [1] | Kim KS.;Huh SH.;Suganuma K. .Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2002(1/2):106-114. |
| [2] | Zhao J;Gao Y L;Zhang W P et al.Observation of the solidification structure of Sn3.SAg droplets prepared by CDCA technique[J].Journal of Materials Science:Materials in Electronics,2012,23:2221-2228. |
| [3] | Yulai Gao;Changdong Zou;Bin Yang .Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2009(1/2):777-781. |
| [4] | Abtew M.;Selvaduray G. .Lead-free solders in microelectronics [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2000(5/6):95-141. |
| [5] | ZHANG Qiu-li,YANG Zhi-mao,DING Bing-jun,LAN Xin-zhe,GUO Ying-juan.Preparation of copper nanoparticles by chemical reduction method using potassium borohydride[J].中国有色金属学报（英文版）,2010(z1):240-244. |
| [6] | Zou C D;Gao Y L;Yang B et al.Size-dependent melting properties of tin nanoparticles by chemical reduction synthesis[J].Transactions of Nonferrous Metals Society of China,2010,20:248-253. |
| [7] | Yasuda H.;Mori H.;Mitsuishi K. .Particle-size dependence of phase stability and amorphouslike phase formation in nanometer-sized Au-Sn alloy particles - art. no. 094101[J].Physical Review.B.Condensed Matter,2001(9):4101-0. |
| [8] | Benjamin J S .Dispersion strengthened superalloys by mechanical alloying[J].Metallurgical and Materials Transactions,1970,1(10):2943-2951. |
| [9] | Hongjin Jiang;Kyoung-sik Moon;Fay Hua .Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders[J].Chemistry of Materials: A Publication of the American Chemistry Society,2007(18):4482-4485. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%