以聚甲基乙烯基硅氧烷为基础硅油,端含氢硅油为扩链剂,侧链含氢硅油为交联剂,辅以铂金催化剂和炔醇类抑制剂,制备了一种用于大功率IGBT灌封的双组份有机硅凝胶。研究了聚甲基乙烯基硅氧烷中乙烯基官能团位置、扩链剂与交联剂摩尔比、催化剂与抑制剂用量等对硅凝胶性能的影响。结果表明:选用500~1500 mPa·s粘度的端乙烯基硅油,扩链剂与交联剂的摩尔比为0.7∶0.3~0.8∶0.2,铂催化剂用量为5 ppm,抑制剂用量为0.2%,可获得无色透明、锥入度为87左右、适用期约为140 min的硅凝胶。该硅凝胶的粘结性强、自修复性好、电绝缘性优异,将其灌封于6500 V IGBT模块内,该模块顺利通过振动、高温存储、低温存储等多项应用性试验。
A kind of two-component novel silicone gel for high-power IGBT was prepared by poly (methyl vinyl siloxane) as base silicone oil, terminal hydrogen-containing silicone oil as chain extender, side-chain hydrogen-containing silicone oil as crosslinking agent, platinum as catalyst and alkynol as inhibitor. The effects of the position of vinyl functional group in poly(methyl vinyl siloxane), molar ratio of chain extender and crosslinking agent, amount of catalyst and inhibitor on the properties of the silicone gel were studied. The results show that when the viscosity of the terminal vinyl silicone oil is 500~1 500 mPa·s, the molar ratio of chain extender and crosslinking agent is from 0.7∶0.3 to 0.8∶0.2, platinum the catalyst amount is 5 ppm, and the inhibitor amount is 0.2%, a kind of colorless and transparent silicone gel with 87 of cone penetration and 140 min of pot life is obtained. The silicone gel has good adhesive, self repair and insulating properties. A kind of 6 500 V IGBT module encapsulated by the silicone gel can pass vibration, high temperature storage, low temperature storage and other application tests.
参考文献
[1] | 陈兴忠;颜书芳;陈雪筠 等.一种大规格IGBT模块及其封装方法[P].CN,201110143687.0,2011-05-31. |
[2] | 叶立剑,邹勉,杨小慧.IGBT技术发展综述[J].半导体技术,2008(11):937-940,951. |
[3] | 章坚.有机硅灌封材料的研究进展[J].精细与专用化学品,2009(08):15-17. |
[4] | 张国栋,邬继荣,张翚鹰,邱化玉,蒋剑雄,来国桥.有机硅凝胶的应用进展[J].日用化学品科学,2007(11):12-14. |
[5] | G. Finis;A. Claudi .On the Dielectric Breakdown Behavior of Silicone Gel under Various Stress Conditions[J].IEEE transactions on dielectrics and electrical insulation: A publication of the IEEE Dielectrics and Electrical Insulation Society,2007(2):487-494. |
[6] | 幸松民;王一璐.有机硅合成工艺及产品应用[M].北京:化学工业出版社,2000:351-352. |
[7] | 来国桥,邬继荣,罗蒙贤,倪勇,颜立成.传感器用双组分加成型硅凝胶的研究[J].有机硅材料,2003(04):1-5. |
[8] | 黄文润.液体硅橡胶[M].成都:四川科学技术出版社,2009:255-256. |
[9] | 黄旭,李娟,韩青霞,宋丽贤,康明,卢忠远,黄渝鸿.有机硅灌封胶用负载型铂催化剂的研究[J].绝缘材料,2011(03):22-25,29. |
[10] | 李娟,黄旭,宋丽贤,卢忠远,康明,黄渝鸿.铂催化加成型有机硅灌封胶的制备及性能[J].绝缘材料,2012(01):5-7. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%