A simple-support bending method was used to evaluate the cracking behavior of a Cu-Ni multilayer on a polyimide substrate. It is found that the crack density of the multilayer does not increase until the strain is less than a critical value (1.54%). The crack-initiation strain is determined to be 0.3%. Theoretical analysis of fracture properties demonstrates that the proposed method is an easy and effective way to evaluate the reliability of a thin film on a flexible substrate. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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