以正硅酸乙酯水解所得的SiO_2微球为内核,采用均匀沉淀法制备具有草莓状包覆结构的CeO_2/SiO_2复合粉体.利用X射线衍射仪、透射电子显微镜、X射线光电子能谱仪(XPS)、动态光散射仪和Zeta电位测定仪等手段,对所制备样品的物相结构、组成、形貌和粒径大小进行表征.将所制备的包覆结构CeO_2/SiO_2复合粉体用于硅晶片热氧化层的化学机械抛光,用原子力显微镜(AFM)观察抛光表面的微观形貌,测量表面粗糙度,并测量材料去除率.结果表明:所制备的CeO_2/SiO_2复合颗粒呈规则球形,平均粒径为150~200 nm,CeO_2纳米颗粒在SiO_2内核表面包覆均匀.CeO_2颗粒的包覆显著地改变复合颗粒表面的电动力学行为,CeO_2/SiO_2复合颗粒的等电点为6.2,且明显地偏向纯CeO_2;CeO_2外壳与SiO_2内核之间形成Si-O-Ce键,两者产生化学键结合;抛光后的硅热氧化层表面在2 μm×2 μm范围内粗糙度为0.281 nm,材料去除率达到454. 6 nm/min.
The SiO_2 nanoparticles prepared by the hydrolyzing tetraethylorthosilicate were directly coated with CeO_2 by chemical precipitation technique. The as-prepared samples were analyzed with X-ray diffractometry(XRD), transmission electron microscope, X-ray photoelectron spectrometer, dynamic light scatter and Zeta potential analyzer. The thermal oxide film covered silicon wafer was polished by CeO_2-coated SiO_2 composite abrasives, and the polishing behavior of the novel composite abrasives was characterized by atomic force microscope (AFM). The results indicate that the monodisperse, spherical CeO_2-coated SiO_2 particles have a particle size of 150-200 nm and are uniformly coated by the CeO_2 nanoparticles. The isoelectric point of CeO_2-coated SiO_2 nanoparticles is about 6.2, which displays a significant shift toward pure CeO_2. The shell CeO_2 is chemically bounded with SiO_2 core, and the Si-O-Ce bond forms between them. The surface roughness within 2 μm×2 μm area of thermal oxide film polished by CeO_2-coated SiO_2 composite abrasives is 0.281 nm, and the material removal rate reaches 454.6 nm/min.
参考文献
| [1] | Boumyoung Park;Hyunseop Lee;Kihyun Park;Hyoungjae Kim;Haedo Jeong .Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry[J].Journal of Materials Processing Technology,2008(1/3):287-292. |
| [2] | SONG Xiao-lan,XU Da-yu,ZHANG Xiao-wei,SHI Xun-da,JIANG Nan,QIU Guan-zhou.Electrochemical behavior and polishing properties of silicon wafer in alkaline slurry with abrasive CeO2[J].中国有色金属学会会刊（英文版）,2008(01):178-182. |
| [3] | Liangyong Wang;Kailiang Zhang;Zhitang Song;Songlin Feng .Ceria concentration effect on chemical mechanical polishing of optical glass[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2007(11):4951-4954. |
| [4] | Feng XD;Sayle DC;Wang ZL;Paras MS;Santora B;Sutorik AC;Sayle TXT;Yang Y;Ding Y;Wang XD .Converting ceria polyhedral nanoparticles into single-crystal nanospheres[J].Science,2006(5779):1504-1508. |
| [5] | Seung-Ho Lee;Zhenyu Lu;S.V. Babu .Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria[J].Journal of Materials Research,2002(10):2744-2749. |
| [6] | SONG Xiao-lan;JIANG Nan;LI Yu-kun;XU Da-yu QIU Guan-zhou .Synthesis of CeO_2-coated SiO_2 nanoparticle and dispersion stability of its suspension[J].Materials Chemistry and Physics,2008,110(01):128-135. |
| [7] | 肖保其,雷红.纳米SiO2/CeO2复合磨粒的制备及其抛光特性研究[J].摩擦学学报,2008(02):103-107. |
| [8] | Lei H;Lu HS;Luo JB;Lu XC .Preparation of alpha-alumina-g-polyacrylamide composite abrasive and chemical mechanical polishing behavior[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2008(10):3005-3008. |
| [9] | ARMINI S;WHELAN C M;MOINPOUR M;MAEX K .Composite polymer core-silica shell abrasives:The effect of polishing time and slurry solid content on oxide CMP[J].Electrochemical and Solid-State Letters,2007,10(09):243-247. |
| [10] | Armini S;Whelan CM;Moinpour M;Maex K .Composite polymer core-silica shell abrasives: The effect of the shape of the silica particles on oxide CMP[J].Journal of the Electrochemical Society,2008(6):H401-H406. |
| [11] | S. Armini;J. De Messemaeker;C. M. Whelan .Composite Polymer Core-Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study[J].Journal of the Electrochemical Society,2008(9):(H)653-660. |
| [12] | ARMINI S;WHELAN C M;MAEX K .Engineering polymer core-silica size in composite abrasives for CMP applications[J].Electrochemical and Solid-State Letters,2008,11(10):280-284. |
| [13] | Cecil A. Coutinho;Subrahmanya R. Mudhivarthi;Ashok Kumar;Vinay K. Gupta .Novel ceria-polymer microcomposites for chemical mechanical polishing[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2008(5P2):3090-3096. |
| [14] | 王其祥,潘海斌,宋宝珍,李洪钟.XPS研究Fe2O3纳米粒子表面包覆无机膜[J].无机材料学报,2002(04):782-786. |
| [15] | Sung-Woo Park;Yong-Jin Seo;Woo-Sun Lee .A study on the chemical mechanical polishing of oxide film using a zirconia (ZrO_2)-mixed abrasive slurry (MAS)[J].Microelectronic engineering,2008(4):682-688. |
| [16] | Nam-Hoon Kim;Pil-Ju Ko;Gwon-Woo Choi;Yong-Jin Seo;Woo-Sun Lee .Chemical mechanical polishing (CMP) mechanisms of thermal SiO_2 film after high-temperature pad conditioning[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(1/2):166-169. |
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