介绍了一种ABS塑料表面电沉积铜工艺,工艺流程主要包括:表面整理,去应力,粗化,敏化,活化,化学镀铜,光亮酸性镀铜.通过平行试验得到ABS塑料上电镀铜的较佳工艺条件为:无水硫酸铜140g/L,硫酸60g/L,氯离子30mg/L,光亮剂3 mL/L,磷铜片阳极(P含量为0.03%～0.06%),温度40℃,电流密度1.5～3.0A/dm2,电镀时间5 min.扫描电镜及性能测试结果表明,所得铜镀层光亮、均匀,与塑料基体结合良好.
A technology for copper electrodeposition on the surface of ABS plastic was introduced.The process flow was presented as follows:surface preparation,destressing,roughening,sensitization,activation,electroless copper plating and acid bright copper electroplating.The process conditions for copper electroplating on ABS plastics were determined by parallel test as follows:anhydrous copper sulfate 140 g/L,sulfuric acid 60 g/L,chloride ion 30 mg/L,brightening agent 3 mL/L.phosphorized copper anode (0.03%-0.06%phosphorus),temperature 40℃,current density 1.5-3.0 A/dm2 and electroplating time 5 min.The results of scanning electron microscopy and performance test showed that the copper deposit on ABS plastics is bright,uniform and well-adhered.
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