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  4. LTCC微波介质陶瓷的研究进展

材料导报, 2011, 25(21): 19-23.

LTCC微波介质陶瓷的研究进展

曹宵 1, , 高峰 2, , 胡国辛 3, , 燕小斌 4, , 田长生 5,

1.西北工业大学材料学院,西安710072

2.西北工业大学材料学院,西安710072

3.西北工业大学材料学院,西安710072

4.西北工业大学材料学院,西安710072

5.西北工业大学材料学院,西安710072

关键词： 微波介质陶瓷 , LTCC , 介电性能

Research Progress of Low Temperatue Co-fired Microwave Dielectric Ceramics

在介绍低温共烧陶瓷(LTCC)技术的基础上,阐述了LTCC技术对微波介质陶瓷的性能要求.综述了ZnO-TiO2、ZnNb2O6、Te基等常用的LTCC材料体系及超低温(≤700℃)烧结微波介质陶瓷体系.目前存在的问题是传统的降温方法很难实现材料高性能与低烧结温度的完美结合,因此在今后的发展中应致力于解决这一问题并研究开发LTCC系列化材料.另外,寻找新型固有烧结温度低的材料体系是未来发展的方向之一.

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