欢迎登录材料期刊网

材料期刊网

高级检索

木材陶瓷是一种典型的“环境材料”,具有原料可再生、低污染、低能耗等优点,以及多孔、导电、自润滑等特性.详细列举了木材陶瓷的应用实例,重点总结了与木材陶瓷相关的复合材料及其性能,并针对木材陶瓷现存的问题,指出了其未来的发展方向.

参考文献

[1] 山本良一;王天民.环境材料[M].北京:化学工业出版社,1997:121.
[2] Okabe T;Saito K.Developmert of woodceramics[M].Amsterdam:Elsevier Science B V,1994:581.
[3] Kondo N;Suda T;Okabe T.Woodceramics thin films[A].Tsukuba,Jpn,1997:218.
[4] Kazuhiro K;Suda T.Woodceramic as humidity sensor[A].Gifu,Jpn,1999:297.
[5] Itakura S;Okabe T;Saito K.Properties of phenolic resin treated wood manufactured by ultrasonic wave resin impregnation method[A].Tsukuba,Jpn,1997:178.
[6] 马荣;乔冠军;金志浩 .木材陶瓷[J].兵器材料科学与工程,1998,21(06):45.
[7] 谢贤清,张获,蔡建国,范同祥.结构功能一体化材料--木质陶瓷的发展及其应用[J].功能材料,2001(02):121-123.
[8] Heino Sieber;Christiane Hoffmann;Annette Kaindl;Peter Greil .Biomorphic cellular ceramics[J].Advanced Engineering Materials,2000(3):105-109.
[9] 谢绍安;晓晨.生物拟态可将木材转化为陶瓷[J].激光与光电子学进展,1998(03):40.
[10] 顾钢 .德国用木材制造碳化硅陶瓷[N].科技日报,1997-523(3.
[11] 马荣;乔冠军;金志浩 .木材陶瓷的制备与性能研究[J].西安交通大学学报,1998,32(08):57.
[12] 陆文达.木材改性工艺学[M].哈尔滨:东北林业大学出版社,1993:8.
[13] 刘树勇.国民科普大课堂[M].南宁:广西人民出版社,2000:64.
[14] Jian-Zhang Li;Takeshi Furuno;Sadanobu Katoh .Preparation and Properties of Acetylated and Propionylated Wood-Silicate Composites[J].Holzforschung,2001(1):93-96.
[15] Miyafuji H;Saka S;Yamamoto A .SiO2-P2O5-B2O3 woodinorganic composites prepared by metal alkoxide oligomers and their fire-resisting properties[J].Holzforschung,1998,52:410.
[16] Tanno F;Saka S;Yamamoto A et al.Antimicrobial TM SAH-Added wood-inorganic composites prepared by the solgel process[J].Holzforschung,1998,52:365.
[17] 王西成;田杰 .陶瓷化木材的复合机理[J].材料研究学报,1996,10(04):435.
[18] 王西成,史淑兰,程之强,候红梅,莫小洪,田杰.(Si-,Al-)陶瓷化木材的化学方法[J].材料研究学报,2000(01):51-55.
[19] 王西成.木材/二氧化硅原位复合材料的界研究[J].材料工程,1998(05):16.
[20] 廖秋霞;卢灿辉;许晨.原位溶胶-凝胶制备木材-PMMA-SiO2复合材料及其显微结构[J].福建化工,2001(01):21.
[21] 李坚;吴玉章.无机质复合木材与复合人造板[J].中国木材,2001(03):52.
[22] Hicks H .Sodium silicate composition[P].US,4612050,1986-09-16.
[23] Mccafferty P .Instant petrified wood[J].Popular Sci,1992,10:56.
[24] 邱玉玲;董岩;姜日顺 .稀土改性杨木材质初探[J].东北林业大学学报,1993,21(01):85.
[25] 安立超;纽红 .陶瓷木材的制备方法[P].CN,93115148.1,1993-06-28.
[26] 周卫平;樊芷芸;庄萍.陶瓷复合木材的处理过程研究(陶瓷复合木材研究之二)[J].硅酸盐通报,1997(增刊):11.
[27] 周平,张志毅,梁树平.毛白杨无机复合木材研究[J].北京林业大学学报,2000(06):39-42.
[28] Yamaguchi H .Low molecular weight silicic acid-inorganic compound complex as wood preservative[J].Wood Science and Technology,2002,36:399.
[29] 张剑峰,郑强,高长有,益小苏.溶胶-凝胶法制备高分子/无机复合材料[J].功能材料,2000(04):357-360.
[30] Shibata K;Okabe T;Saito K et al.Electromagnetic shielding properties of woodceramics made from wastepaper[J].Journal of Porous Materials,1997,4(04):269.
[31] TOSHIKAZU SUDA;NOBUKAZU KONDO;TOSHIHIRO OKABE .Electrical Properties of Woodceramics[J].Journal of porous materials,1999(3):255-258.
[32] Endo H;Shibata K;Kasai K.Fundamental properties of the bambooceramies[A].Tsukuba,Jpn,1997
[33] Kasai K;Shibata K et al.Humidity sensor charaeteristies of woodceramics[J].Journal of Porous Materials,1997,4(04):277.
[34] Kazuhiko K;Suda T.Woodceramics as humidity sensor[A].Gifu,Jpn,1999
[35] Akagaki T;Hokkirigawa K;Okabe T et al.Friction and wear of woodceramics under oil and water lubricated sliding contacts[J].Journal of Porous Materials,1999,6(03):197.
[36] HIROSHI IIZUKA;MASAMI FUSHITANI;TOSHIHIRO OKABE .Mechanical Properties of Woodceramics: A Porous Carbon Material[J].Journal of porous materials,1999(3):175-184.
[37] Gibson L J;Ashby M F.Cellular solids[M].Oxford:pergamon Press,1988:69.
[38] Hirose T;Fushitani M;Okabe T.Study on improvement of strength performances of woodceramics[A].Tsukuba,Jpn,1997
[39] 林峻峰.木陶瓷的开发应用[J].四川林勘设计,2002(02):52-53.
[40] 李淑君,李坚,刘一星.新型炭材料--木陶瓷[J].上海建材,2002(04):19-22.
[41] 王庆,王冬华,任秀彬.小米基生物形态多孔SiC材料[J].硅酸盐通报,2009(z1):143-147.
[42] 钱军民,金志浩,乔冠军.木材陶瓷研究进展[J].无机材料学报,2003(04):716-724.
[43] 孙炳合,张获,范同祥,谢贤清.木质材料陶瓷化的研究进展[J].功能材料,2003(01):20-22,28.
[44] Xie Xian-qing;Fan Tong-xiang;Zhang Di .Increasing the mechanical properties of high damping woodceramics by infiltration with a magnesium alloy[J].Composites science and technology,2002(10/11):1341-1346.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%