弥散强化铜具有高强、高导、耐热的特性,是综合性能最好的一类铜合金.比较了原位与非原位制备弥散铜的性能,总结了影响弥散强化铜性能的因素,综述了目前具有产业化前景的原位方法制备弥散铜,最后介绍了弥散强化铜的应用领域.
参考文献
[1] | ASM International Handbook Committee.ASM metals handbook[M].Ohio:ASM International the Materials Company,1990 |
[2] | 亢若谷 .弥散强化铜合金的现状与发展[J].云南冶金,1995,24(05):1. |
[3] | 郭明星,汪明朴,李周,曹玲飞,程建奕.原位复合法制备纳米粒子弥散强化铜合金研究进展[J].机械工程材料,2005(04):1-3. |
[4] | 中国材料工程大典编委会.中国材料大典.第10卷:复合材料工程[M].北京:化学工业出版社,2006:498. |
[5] | 中国材料工程大典编委会.中国材料大典.第8卷:无机非金属材料工程[M].北京:化学工业出版社,2006 |
[6] | 宁爱林,申奇志,彭北山,莫亚武.不同增强相弥散强化铜的导电性[J].湖南有色金属,2002(06):34-36. |
[7] | 林鹤云,王念春.电接触合金材料导电率的三维有限元分析[J].东南大学学报(自然科学版),2002(04):627-630. |
[8] | 李勇 .氧化铝颗粒弥散强化铜基复合材料的研究[D].华中科技大学,2005. |
[9] | 李红霞 .Al<,2>O<,3>弥散强化铜内氧化动力学及其再结晶研究[D].河南科技大学,2005. |
[10] | 刘平;田保红;赵冬梅.铜合金功能材料[M].北京:科学出版社,2005 |
[11] | Li Guobin;Sun Jibing;Guo Quanmei .Fabrication of the nanometer Al_2O_3/Cu composite by internal oxidation[J].Journal of Materials Processing Technology,2005(1/2):336-340. |
[12] | 钟卫佳.铜加工技术实用手册[M].北京:冶金工业出版社,2007:907. |
[13] | 张修庆 .碳化物弥散强化铜基复合材料的研究[D].昆明理工大学,2001. |
[14] | Biselli C;Morris D G;Randal N .Mechanical alloying of high-strengthened copper alloys containing TiB2 and Al2O3 dispersoid particles[J].Scripta Metallurgica et Materialia,1994,30(10):1327. |
[15] | Takahashi T;Hashimoto .Preparation of TiC dispersionstrengthened copper by the application of mechanical alloying[J].Journal of the Japan Society of Powder and Powder Metallurgy,1989,36(07):837. |
[16] | Rodrigo H. Palma;Aquiles O. Sepulveda;Rodrigo G. Espinoza;Alejandro P. Zuniga;M. Jesus Dianez;Jose M. Criado;M. Jesus Sayagues .High-temperature mechanical behaviour of Cu-Ti-C, Cu-Al and Cu-Ti-Al-C alloys obtained by reaction milling[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2004(1/2):262-269. |
[17] | F. Shehata;A. Fathy;M. Abdelhameed;S.F. Moustafa .Preparation and properties of Al_2O_3 nanoparticle reinforced copper matrix composites by in situ processing[J].Materials & design,2009(7):2756-2762. |
[18] | 董仕节,史耀武,雷永平,Y.Zhou.(TiB2+Al2O3)增强铜基复合材料的研究[J].材料工程,2002(07):6-11. |
[19] | 严红革;陈振华 .反应球磨技术原理及其在材料制备中的应用[J].功能材料,1997,28(01):15. |
[20] | 谢昭德,施雨湘,倪俊杰.机械球磨过程控制技术的研究进展[J].材料导报,2003(11):23-25,59. |
[21] | Arthur K L;Turker Oktay S;Suh N P .Liquid-metal mixing process tailors MMC microstructure[J].Advanced Materials & Processes,1992,142:31. |
[22] | 郭明星 .纳米弥散强化铜合金短流程制备方法及其相关基础问题研究[D].中南大学,2008. |
[23] | 张淑英;陈玉勇;李庆春 .反应喷射沉积金属基复合材料的研究现状[J].兵器材料科学与工程,1998,21(05):52. |
[24] | 李奎,汤爱涛,潘复生.金属基复合材料原位反应合成技术现状与展望[J].重庆大学学报(自然科学版),2002(09):155-160. |
[25] | Lee Jongsang;Jung J Y;Lee Eon Sik et al.Microstructure and properties of titanium boride dispersed Cu alloys fabricated by spray forming[J].Mater Eng A,2000,277:274. |
[26] | Perez J F;Moris D G .Copper-Al2O3 composites prepared by reactive spray deposition[J].Scripta Metallurgica et Materialia,1994,31(03):231. |
[27] | [OL].http://www.ipm.com.cn/supj200702.htm,2007-02. |
[28] | Markus Hofmockel;Hans-Claus Neubing.ECKA discup(R) new high performance PM copper materials Process,properties and applications[A].,2004 |
[29] | 高陇桥.微波电子器件用铜及其合金的应用开发[J].上海有色金属,2001(01):1-5. |
[30] | 张文毓.氧化铝弥散强化铜应用进展[J].世界有色金属,2008(07):60-61. |
[31] | Solomon R R;Troxell J D;Nadkami A V .GLIDCOP AL25 first wall plates-IG1 grade compared to IGO grade[J].IEEE,1998,2:853. |
[32] | Chidley B G;McMichael G E;Tran-Ngoc T .New vanes for RFQ1:Fabrication,installation,and tuning[J].IEEE,1998,2:3047. |
[33] | Schulman M.B.;Wootton R.E. .HART hypervelocity augmented railgun test facility[J].IEEE Transactions on Magnetics,1993(1):505-510. |
[34] | Frank L Krawczyk;Gerald O Bolme;WilliamL Clark.RFloss measurements in an open coaxial resonator for characterization of copper plating[A].,2007:2376. |
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