以双酚A型环氧树脂E-44为粘接相，以QNP1(端叔胺基超支化聚酯复合物)为潜伏性固化剂，采用非等温示差扫描量热法(DSC)研究了E-44/QNP1体系的固化行为，以55%银粉为导电填料，研究了固化反应时间对导电浆料电性能的影响。E-44/QNP1体系在25~200°C范围内的固化反应热力学研究结果表明，固化剂QNP1的最佳用量为25%，并根据Kissinger和Crane方程拟合出固化反应动力学方程；在110°C/20 min最优固化条件下制备的E-44/QNP1导电银浆，其固化膜的电阻率最小，为3.5×10?5?·cm，可以满足硅异质结太阳能电池顶部电网电极银浆的应用要求。
The curing behavior of E-44/QNP1 system was studied with bisphenol-A epoxy resin E-44 as binder and QNP1, a composite mainly consisting of tertiary amino-terminated hyperbranched polyester, as latent curing agent by non-isothermal differential scanning calorimetry (DSC) method. The influence of curing reaction time on electrical property of a conductive paste containing 55% silver powders as conductive filler was examined. The results of thermodynamic study on the curing reaction of E-44/QNP1 system in temperature range of 25-200 °C indicated that the optimal content of curing agent QNP1 is 25%. The kinetic equation was fitted based on Kissinger and Crane equations. The resistivity of the cured film of E-44/QNP1 conductive silver paste obtained under the optimal curing conditions (namely at 110 °C for 20 min) is minimum, 3.5 × 10?5?·cm, meeting the application requirement of top-grid electrode of silicon hetero-junction solar cells.
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