采用双靶磁控溅射共沉积方法制备Cu-W薄膜,其微观结构及形貌通过XRD、TEM和SEM方法测试,结果表明,Cu-W薄膜是由Cu固溶于W或W固溶于Cu的亚稳态固溶体组成,且随着W含量的增加,Cu-W薄膜依次形成面心立方fee结构的Cu基亚稳固溶体、fee和bee结构固溶体的双相区以及体心立方bee结构的W基亚稳固溶体,晶粒尺寸随溶质原子含量的增加而减小.这些亚稳固溶体的形成是由于溅射出的原子动能足以克服Cu、W固溶所需的混合热.以及溅射过程中粒子的纳米化和成膜过程中引入的大量缺陷造成的.
参考文献
| [1] | Nikola Radic;Biserka Grzeta;Davor Gracin;Tihomir Car .Preparation and structure of Cu-W thin films[J].Thin Solid Films,1993,228(1-2):225-228. |
| [2] | O.Auciello;S.chevacharoenkuI;M.S.Amenn;J.Duarte .Controlled Ion beam sputter deposition of W/Cu/W Iayered films for microelectronic applications[J].Vac Sci Technol,1991,9(03):625-631. |
| [3] | K.J.Whal;L.E.Seitzman;R.N.Bolster;I.L,Singer,M.B.Peterson .Ion-beam deposited Cu-Mo coatings high temperature.solid lubricants[J].Surface and Coatings Technology,1997,89(03):245-251. |
| [4] | J.Pacaud;G.Gladyszewski;C.Jaouen;A.Naudon,Ph Goudeau,J.Grilhe .Low-tempertature mixing in.Cu/W superlattices irradiated with light and heavy ions[J].Applied Physics,1993,73(06):2786-2793. |
| [5] | Rui-Fen ZHANG;Zheng-Cao Li;B.)[.Liu .MetastablePhase Formed in Immiscible Cu-W Muhilanyers by Ion Mixing[J].Japanese Journal of Applied Physics,2003,42(11):7009-7012. |
| [6] | Wang Y;Xu KW .Characterization of surface morphology of copper tungsten thin film by surface fractal geometry and resistivity[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(1/2):310-315. |
| [7] | C.H. Lin;J.P. Chu;T. Mahalingam .Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study[J].Journal of Materials Research,2003(6):1429-1434. |
| [8] | K. Barmak;G. A. Lucadamo;C. Cabral .Dissociation of dilute immiscible copper alloy thin films[J].Journal of Applied Physics,2000(5):2204-2214. |
| [9] | 范毓殿,周志烽.薄膜溅射沉积过程中的原子喷丸效应[J].真空科学与技术,1996(04):235-241. |
| [10] | Miedema A R;Chatel P F;Boer F R .Cohesion in alloyingfundamentals of semi-empirical model[J].Physica,1980,100B(01):1-28. |
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