为开发THPED-EDTA•2Na化学镀厚铜工艺，研究了添加剂L-精氨酸，聚乙二醇（PEG）和亚铁氰化钾（K4Fe(CN)6）对化学镀速、镀层质量及镀液稳定性的影响。结果表明，适量L-精氨酸能显著提高化学镀速，其适宜的添加量为0.15 mg•L-1； PEG和K4Fe(CN)6使铜还原速率有所降低，但均能改善镀层外观质量，其适宜的添加剂用量分别为150 mg•L-1 和20 mg•L-1。三种添加剂均能提高镀液稳定性，混合添加剂稳定性最高，80℃下稳定时间近5 h。在适宜条件下镀速为7.10 μm•h-1，施镀15 min后获得的镀层表面平整、晶粒细致和外观红亮。沉积层为立方晶系铜，且在(111)晶面择优沉积，背光级数达到10级。
The influences of additives on plating rate, coating quality and bath stability were investigated to develop THPED-EDTA•2Na thick copper plating process. The plating rate is obviously increased by proper amount of L-arginine, and its proper dosage is 0.15 mg•L-1; the coating quality is greatly improved by proper amount of PEG and ferrous potassium cyanide in spite of slight decrease of plating rate, and the proper amount are 150 mg•L-1 and 20 mg•L-1, respectively. The stability of bath is enhanced by all these additives and the stability time of bath in which mixed additives is added reaches the highest of 5 h at 80℃. The plating rate is 7.10 μm•h-1 and the backlight level achieves 10th grade under appropriate conditions after plating for 15 min. The coating is red, bright and uniform, the sedimentary layer is cubic copper and the crystal of copper coating is mainly assigned to the (111) face.
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