为解决高集成度计算机芯片、光电器件等引发的热障问题并降低能耗,本文基于前期研究基础,试验探索不同加热功率下基于芯片自身发热量来驱动液态金属循环,从而达到冷却芯片的方案.分析表明,该方法能有效降低芯片表面与环境之间的热阻.试验显示,热量通过热电片转化的电能,驱动液态金属电磁泵,并且在未设置风扇的情况下实现了50W的散热量;而且,加热功率越高,热电片产生电流越大,从而驱动力越强.这种热驱动型液态金属芯片散热器是一种完全静音、自适应、无需外部能苗输入的先进芯片散热器.
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